This section lists suppliers of flip chip services, equipment, and materials.

Each listing summarizes the supplier's capabilities and links to their web site.

CLICK on the supplier name at the beginning of their listing to link to their site.

ADHESIVES AND UNDERFILLS

Through its 17 worldwide offices, Ito Group provides a wide range of equipment, materials, components, and services oriented toward companies doing high density printed circuit board and FPD assembly. Ito has a strong focus on anisotropic conductive film (ACF) and other anisotropic conductive adhesive technologies, and is one of the charter members of the Flexible Display Center, where it handles ACF bonding technologies through its ACF Applications Lab. Ito Group also sponsors www.autoacf.com , a resource for people and companies wanting to learn more about ACF, ACP, and ACA technologies.

Ito America Corporation
7700 S. River Parkway
Tempe, AZ 85284 USA

TEL: 480-998-2250
FAX: 602-296-0483

Creative Materials, Inc. custom formulates electrically conductive adhesives, inks, and coatings for a variety of electronic applications, including flip chip assembly. CMI's low curing temperature two-part formulations allow flip chip adhesive assembly with cure temperatures of 65 Degrees Celsius or lower, ideal for temperature sensitive components such as cadmium zinc telluride (CdZnTe) detector arrays and pyroelectric deposited-film IR detectors.

CMI also manufactures a variety of thermally conductive encapsulants and adhesives, and a complete line of electrically conductive pad printable materials for printing conductive patterns onto complex geometric surfaces.

Creative Materials, Incorporated 141 Middlesex Road (Rte. 3A), Tyngsboro, MA 01879
Phone 978-649-4700 FAX 978-649-2040
Email AppSupport@Creative Materials.com

ASSEMBLY EQUIPMENT

Arc Technologies is both a manufacturer and an engineering partner, helping you to develop and produce flip chip products. Arc produces flip chip tooling to your specifications, including high precision machining of silicon carbide as required.

Our Suss FC-150 flip chip aligner-bonder offers unmatched precision and versatility for your assemblies.

As your development and assembly partner, ARC can serve your flip chip needs from first prototypes to production products.

Arc Technologies
www.arcnano.com        Email   mdugas@arcnano.com

FINETECH provides unique, versatile equipment solutions for flip chip bonding, high accuracy microelectronic and opto-electronic placement, and advanced rework. The systems can handle today's most advanced processes and packages.

The fully automated FINEPLACER® FEMTO , with +/- 0.5 micron accuracy, is capable of handling the assembly and bonding of laser bars and diodes, flip chip, VCSELs, MEMs, sensors, micro-optics, surface mount photonics, as well as simple die attach. The system combines high accuracy and process flexibility with the smallest footprint in the market (1270 x 900 mm). Bonding processes are automatically controlled, requiring no operator intervention during the alignment and bonding procedure.

The simplicity and 1 micron accuracy of the Fineplacer® Lambda and the versatility of the Fineplacer® Pico platform are ideal for research, product and process development, prototyping, and lower volume production. Flip chip bonding technologies include eutectic soldering, AuSn Soldering, thermo-compression, thermo-sonic / ultrasonic bonding, adhesive technologies, ACP (Anisotropic Conductive Paste) and Chip On Glass (ACF).

FINETECH offers the complete rework/repair process for flip chip, BGA, CSP, small passives, various surface mounted devices, and lead free solder materials. The FINEPLACER® Pico is the most versatile base module. It can be used for both flip chip bonding and rework.

FINETECH's innovative, modular approach allows customization of all bonder and rework systems and provides process flexibility. Manual, semi-automatic and automatic configurations are available. All machines have a patented fixed beam-splitter technology.

FOR MORE INFORMATION

Ultimate Bonder Video

FINEPLACER® FEMTO

Multi-Application Flip Chip

What is Flip Chip?

Finetech, Inc.   8380 South Kyrene Road #110   Tempe,  AZ  85284  USA
Phone 480-893-1630,    Email sales@finetechusa.com

From the KADETT semi-automated R&D device bonder, through the automated FC150 to the industry-leading FC300 high-force device bonder, SET offers a continuous process path from research to production.

With post bonding accuracies better than 1 micrometer, and leveling capabilities of 2.5 microradians, SET bonders are ideally suited to today's Advanced Photonics Packaging market. The SET TRIAD 05 AP is an industry-leading, high-accuracy automated flip chip bonding system for cost-effective volume production of optoelectronics modules. This is the world’s first bonding system to offer both passive alignment and active alignment for fine-tuning optical assemblies.

SET also supplies a new generation of nano-imprint lithography (NIL) production equipment. The Nano-imPrinting Stepper NPS300 is the first NIL equipment which offers both aligned hot embossing and UV-NIL on the same platform for wafers up to 300mm. The NPS300 provides a sub-20 nm imprinting resolution in a system that is optimized for the cost-effective volume production replication of micro or nanometer scale devices.

FOR MORE INFORMATION

TECHNICAL PAPERS:  The third issue of SET'S TECHNICAL BULLETIN  is now available free of charge!   INFORMATION

SET SAS, BP24, 131 Impasse Barteudet, F-74490 St Jeoire, France
Phone +33 4 50 35 83 92, FAX +33 4 50 35 88 01
Email info@set-sas.fr
www.set-sas-fr

ASSEMBLY EQUIPMENT

See also ITO Group

ASSEMBLY SERVICES

Arc Technologies is both a manufacturer and an engineering partner, helping you to develop and produce flip chip products. Our Suss FC-150 flip chip aligner-bonder offers unmatched precision and versatility for your assemblies.

Arc also produces flip chip tooling to your specifications, including high precision machining of silicon carbide as required.

As your development and assembly partner, ARC can serve your flip chip needs from first prototypes to production products.

Arc Technologies
www.arcnano.com       Email   mdugas@arcnano.com

BUMPING SERVICES

TLMI Corporation provides expertise and quality services for all of your wafer bumping needs. We focus on high quality prototyping, advanced development, and lower volume production bumping of two inch to eight inch wafers.

• Prototyping and quick turns, 1 to 100 wafers per order.

• Specialized materials and applications (solder, gold, copper, indium, polymers, redistribution).

• Low to medium volume production of 50 to 500 wafers per month.

• Prototyping and production of 2, 3, 4, 5, 6, &  8 inch wafers.

• Mask design.

• Custom development.

• Dicing, pick & place, and back-grinding through local subcontractor.

TLMI Corporation    2111 West Braker Lane, #500    Austin    TX 78758-4054
Phone    512-833-7075     FAX    512-833-7283
Email    sales@tlmicorp.com

CONSULTING & TRAINING SERVICES

E&G Technology Partners specializes in technology commercialization and business development for advanced technology. We apply our industry-leading experience to providing our clients with value-added solutions for technology development, market analysis and penetration, business strategy, and licensing.

E&G Technology Partners, LLC.
1840 East Warner Road       Suite A105 # 249     Tempe,   AZ     85284
Email info@egtechpartners.com    FAX 623-321-1700    www.egtechpartners.com

DOCTOR FLIPCHIP offers flip chip consulting, training, and problem solving, on site or on line. In-company group training sessions use proven material, tailored to your company needs.

REDISTRIBUTION SERVICES

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