Figure 1. Die profile with pads.

For bipolar dual-die products, both anodes are on the same side of the die, with pads surface mounted right to the board. The backside is conductive but requires no connection to the board in any way.

For unipolar products, both the anode and the cathode are on the same side of the die, in a "one and a half" pad configuration. The backside is conductive but again requires no connection to the board.

The devices have all of the usual flip chip advantages: lowest profile, smallest footprint, highest power-handling to size ratio. The height is 0.015 inches, with die sizes as small as 0.030 x 0.044 inches. The flip-die can handle 10 times the current of similarly sized devices in conventional surface mount packages.

The flip die have fully glass passivated surfaces, so no encapsulation or underfill is required. There are no internal solder joints, for higher reliability. The high ratio of pad to die area gives great mounting strength to withstand both temperature extremes and vibration.

Flip die are available in a full range of zeners, unidirectional and bi-directional transient suppressors, and standard, fast, and ultra-fast rectifier power diodes. Some common popular cross-references available in this form are 1N4000-1N4007, P3KE through P6KE, 1.5KE, and ½ watt to 10 watt zeners.

Sussex Semiconductor    12251 Towne Lake Drive    Fort Myers, FL 33913
Phone   941-768-6800    FAX   941-768-6868

www.sussexsemiconductor.com