Email DrFlipchip  @  doctorflipchip.com  URL www.DoctorFlipchip.com

Tutorial 1.   Introduction to Flip Chip

Tutorial 2.   Solder Bump Flip Chip

Tutorial 3.   Stud Bump Flip Chip

Tutorial 4.   Polymer Bump Flip Chip

Tutorial 5.   Anisotropic Conductive Film (ACF)Flip Chip

Tutorial 6.   A Brief History of Flipped Chips

Tutorial 7.   Electroless Nickel-Gold Flip Chip

Tutorial 8.   Reworking Underfilled Flip Chip

Tutorial 9.   Thermosonic Flip Chip Assembly

Tutorial 10.   Flip Chip Interconnection for Detector Arrays

Tutorial 11.   Under Bump Metallization (UBM)

Tutorial 12. Solder Bumping Step by Step

Tutorial 14.   Bonding Edge Emitting Laser Diodes Using Gold/Tin Preforms

Tutorial 15.   Substrates for Flip Chip

Tutorial 16.   Packaging, Handling, and Storing of Solder Spheres

Tutorial 17.   SOC, SOP, and WLSCP

Tutorial 18.   Fluxing for Flip Chip

Tutorial 20.   Causes of Misalignment

Tutorial 21.   Probing Bumped Flip Chips

Tutorial 22.   Controlling Stress in Thin Films

Tutorial 23.   Reworking Anisotropic Conductive Film (ACF) Flip Chip Assemblies

Tutorial 24.   Gold Stud Bump Applications

Tutorial 25.   Low Temperature Flip Chip for Flexible Displays

Tutorial 26.   The Coming of Copper UBM

Tutorial 27.   Shaping Gold Ball Bumps

Tutorial 28.   Copper Bumps for Flip Chip Assembly

Tutorial 29.   Micro-Posts: Tall, Slender, Stud Bumps.

Tutorial 30.   Measuring thin films by spectral reflectance, Part 1

Tutorial 31.   Wafer level hermetic cavity chip scale packages for RF

Tutorial 32.   Gold Stud Bumping - the Other Flip-Chip Process

Tutorial 33.   Conductive Polymer Assembly of High Pin Count Flip Chip

Tutorial 34.   Sputtered nickel UBM for lead-free solder bumping

Tutorial 35.   Measuring thin films by spectral reflectance, Part 2

Tutorial 36.   MEMS Special Packaging Needs

Tutorial 37.   Too much gold can be a bad thing.

Tutorial 38.   Evaporated Indium Bumps for Flip Chip

Tutorial 39.   Electromigration and Thermomigration in Flip Chip Solder Joints

Tutorial 40.   Nano-embossing reaches production.

Tutorial 41.   Hermeticity: much to do about nothing.

Tutorial 42.   Evaluating Wafer Level Solder Reflow Options to Maximize Yield

Tutorial 43.   Wafer-level Hermetic Cavity Packaging.

Tutorial 44.   Advanced Wafer-level Cleaning Method.

Tutorial 45.   Lead-Free Facts and Myths.

Tutorial 46.   Alloy Electroplating: The best solution for Au-Sn solder?

Tutorial 47.   Flip Chip Bonder for Assembling 3D MEMS

Tutorial 48.   Drop-in Lead-free solder

Tutorial 49.   Wafer-level Nano-optics

Tutorial 50.   Gold Stud Bump Update

Tutorial 51.   Solder Bumping Single Die

Tutorial 52.   New Generation Nano-Imprint Lithography System

Tutorial 53.   Probe testing differences in lead-free bumps

Tutorial 54.   Nano Particle Adhesives

Tutorial 55.   The Promise of C4NP

Tutorial 56.   Injection Molding Solder Bumps

Tutorial 57.   Thermosonic Bonding of 1,000-bump Flip Chips

Tutorial 58.   Nanosoldering electronic components at room temperature

Tutorial 59.   Lower temperature lead-free flip chip

Tutorial 60.   Nanotube Heat Sinks

Tutorial 61.   Lead-Free Solder Bumping Methods

Tutorial 62.   Vapor Jet Deposition of Multi-Metal Films

Tutorial 63.   C4NP Test Data

Tutorial 64.   Silver Nano-platelet Precursors for Ultra-Thin Conductors

Tutorial 65.   Cleaning microelectronic devices by Vacuum Cavitational Streaming

Tutorial 66.   The Folly of RoHS

Tutorial 67.   Underfilling Processes

Tutorial 68.   Plasma pretreatment of Flip Chip and CSP assemblies

Tutorial 69.   Resonance Sensor Technology for Bump Inspection

Tutorial 70.   Controlled-expansion substrates for WLP

Tutorial 71.   Nailing ICs Together

Tutorial 72.   Redistribution Layers

Tutorial 73.   Advanced Rework

Tutorial 74.   High Conductivity Nickel-Fiber ACF

Tutorial 75.   Unique Polished Polyimide Substrate

Tutorial 76.   Jet Dispensing of Underfills

Tutorial 77.   Solderless Copper Assembly

Tutorial 78.   Quilt Packaging

Tutorial 79.   Bump Cooling

Tutorial 80.   Nano-particle Solder Paste

Tutorial 81.   Wafer-level CSP with Integrated Passives

Tutorial 82.   Putting Photons on the Chip

Tutorial 83.   Soldering Stud Bumps

Tutorial 84.   Avoiding Lead-Free Brittle Fractures