This is the latest in a series of flip chip tutorials intended for new flip chip users, potential users, and those interested in specific flip chip processes and applications. Tutorial #1 presents the basics: an overview of what flip chip is and does, and how it is made. The other tutorials cover a wide range of topics in more detail. Concurrently, FlipChips Dot Com’s Technology Updates present industry experts describing the newest developments in their fields; our Literature and Photo pages give supplemental material.

This tutorial describes new resist stripping chemistries required to remove thick resist and to perform well with the higher temperatures of lead-free solders. It appeared in Advanced Packaging Magazine, July 2004, and is linked here with permission of the publisher.

FOR MORE INFORMATION:

Diane Scheele, Director of Technical Services
Dynaloy Inc. PO Box 33609, Indianapolis, IN 46203
dianescheele@dynaloy.com

Thomas Goodman, Managing Partner
E&G Technology Partners LLC,
1840 East Warner Rd. A105, #249, Tempe, AZ 85284 tgoodman@egtechpartners.com

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