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Tutorial 32 - July, 2003

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OVERVIEW

This is the latest in a series of flip chip tutorials intended for new flip chip users, potential users, and those interested in specific flip chip processes and applications. Tutorial #1 presents the basics: an overview of what flip chip is and does, and how it is made. The other tutorials cover a wide range of topics in more detail. Concurrently, FlipChips Dot Com’s Technology Updates present industry experts describing the newest developments in their fields; our Literature and Photo pages give supplemental material.

 

Gold Stud Bumping - the Other Flip-Chip Process

Eric Bogatin
Contributing Editor
Semiconductor International

This recent article appears with permission of the publisher, Semiconductor International

FULL TEXT

 

 

FOR MORE INFORMATION:

  • Gold stud bump flip chip is the subject of Tutorials 3, 9, 24, and 27.

  • Several stud bump photos appear in the Photo Gallery

  • Searching this site on "stud bump" returns 22 citations on the site.

  • A complete system for gold stud bumping and assembly, which produced the sample pictured in this Tutorial, is available from Palomar Technologies


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