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"Lead-Free Solder Interconnect Reliability"
Donkai Shangguan, Editor
ASM International, 2005 302 Pages ISBN 0 - 88170 - 816 - 7
"Lead-Free Solder Interconnect Reliability" is the first book focused entirely upon this crucial electronics packaging industry topic. Until now, the reliability information used in selecting lead-free alloy formulations has been scattered among hundreds of reports and conference papers. This book brings together the key findings – more than 600 papers are cited – clearly presented and explained in well-written chapters by 15 expert contributors to the related disciplines.
The result is a practical guide to understanding, achieving, and maintaining lead-free reliability that should become a first-choice source for every engineer concerned with lead-free.
The opening chapter, by editor Dongkai Shangguan, gives a comprehensive overview of the current status and continuing challenges of the lead-free transition. He stresses that
lead-free reliability demands a holistic approach, embracing everything from supply-chain management to product end-of-life. Maintaining the compatibility of design, materials, process, reliability, and business issues at every step is essential to a successful lead-free program.
The following five chapters provide a firm base of physical, chemical, metallurgical, and reliability knowledge. Topics include lead-free solder joint microstructure, interfacial interactions, fatigue and creep, reliability trends, chemical interactions, reliability testing, and tin whisker growth dynamics.
The focus is on two leading lead-free alloys, the ternary eutectic Sn-Ag-Cu (SAC) for solder reflow and wave soldering, and the binary Sn-0.7Cu alloy for lower-cost wave soldering. Frequent comparisons are made of the differences between lead-free alloys and current solders under various conditions.
The next four chapters are forward-looking, shifting from the solder properties to the tools required to measure and maintain lead-free reliability. Topics include developing accelerated testing methods for lead-free connections, modeling lead-free interconnects for thermal reliability prediction, applying finite-element models for lead-free interconnects, and analyzing lead-free failures.
Since conductive adhesive interconnection might also be a lead solder alternative in some applications, the final technology chapter summarizes the reliabilities and failure mechanisms of both isotropic and anisotropic conductive adhesives. Solder addicts might find this a challenging educational interlude, especially when the adhesive nanoparticle falls into the quantum well.
The closing chapter by the editor continues the forward-looking orientation of the book, with a reliability outlook identifying eight major topics requiring more research. As one of the contributing experts earlier pointed out, the electronics industry is at only the beginning of its learning curve for lead-free solder reliability. I recommend this book as a helpful guide and a dependable resource on the steep climb that lies ahead of us.
REVIEWED BY: George Riley, FlipChips Dot Com
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