"Fundamentals of Microsystems Packaging" is an informative, well-written textbook, the first to cover this rapidly-evolving technology. Professor Tummala’s latest book should appeal to only three groups: those who know a lot about microsystems packaging, those who know something about it, and those who know nothing about it.

For packaging specialists, who progressed by focusing in one limited area of packaging, this book is a refreshing tonic. It gives you a formalized (equations and all!) infusion from those associated technical fields that you were forced to bypass, broadening your expertise and allowing you to understand the challenges other packaging specialists face.

For the semi-knowledgeable, those perhaps with a background in engineering, chemistry, materials science, manufacturing, quality, design, purchasing, marketing or management, but not specialized in microsystems packaging, this book is an essential nutrient. It provides a well-balanced diet of the key elements of packaging that you need to fully understand the field. You’ll learn all of the important things, and know where to find more about those areas essential to you.

For the novices, graduate students, advanced undergraduates, senior executives, venture capitalists, journalists, and other intellectual vagabonds, this book is a stimulant. It exposes you to the whole sweep of a fast-growing and exciting field, where you may hope someday to make your mark, or your millions. You are encouraged and assisted, guided and challenged. Where you go with it is up to you.

This comprehensive textbook offers to all of the above groups a firm grounding in the diverse disciplines comprising microsystems packaging. Nineteen of the chapters share the title, "Fundamentals of …". "Fundamental" means "a foundation," and that is what these chapters provide, covering the key elements of topics ranging from semiconductors to systems, including design, processing, materials, manufacture, testing, performance, reliability, thermal management, and environmental considerations.

For the specialist, who must build upon these foundations, each chapter includes a judicious selection of recommended further readings. For the autodidact, the scholar, or the flagellant, there are even homework problems to test your knowledge. Four chapters, covering optoelectronics, MEMS, RF packaging, and wafer-level packaging, lead the venturesome to the borders of today’s knowledge, where they might glimpse the promised land, or just gape at the dark forests of ignorance.

Although the text is the child of fifty authors, the logical flow and smooth editing make it a unified work that speaks with one clear voice. Despite their diversity, the 2:1 ratio of academic to practitioner authors makes a good balance of technical rigor and practical experience. Talented illustrators provided a wealth of informative two-color pictures, charts, pictures, and diagrams.

In summary, after forty years in microelectronics research, engineering, management, and consulting, I thought that perhaps I finally knew it all. This book made me realize there were some things that I only thought I knew. I believe that many of you might benefit from a similar self-revelation.

REVIEWED BY: George Riley, FlipChips Dot Com

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