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Book Review
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"Adhesives Technology for Electronics Applications" William Andrew, Inc., 2005. 450 Pages. ISBN 0-8155-1513-8 "Adhesives Technology for Electronic Applications" is the first book dedicated exclusively to the electronic applications of adhesives. It leaves no need for another such book, at least until this generation gives way to nano or other adhesives. It is many books in one: textbook, handbook, reference book, catalog, history book. Together, all exhaustively cover the what, why, and how of electronics adhesives. First, the history traces the development of adhesives for electronics assembly through four generations, beginning in the 1960’s, revealing the problems encountered and solved as adhesive chemistry grew more sophisticated. The textbook follows, providing the physics and chemistry foundations in a theory of how adhesives work. The four main functions of electronics adhesives, adhesion, electrical conductivity, heat transfer and stress control, are examined sequentially. The chemistry chapter details the formulations and properties of eight major adhesive families used in electronics. Past these textbook underpinnings, the handbook/catalog begins with the chapter on bonding manufacturing processes. This longest chapter (93 pages, 25 tables) follows the factory production flow, from pre-cleaning to final curing, and, alas, rework. Material, equipment, and processes are extensively covered, both with tables of generic information and examples of commercial products and their features, by supplier and model number. The reference book takes a different useful viewpoint, examining all the major adhesive end-use applications. It illustrates how different requirements logically lead to different adhesive solutions. The message is clear: in the world of adhesives, one size doesn’t fit all. The concluding two chapters, on reliability and on testing, are a logical pair, sharing tables of specifications, test methods, and examples of test results. One useful table lists the sources for many government and commercial specifications and standards. Overall, the book judiciously mixes clear explanations with extensive tabular information and more than 400 literature references. Having no index to the 76 tables is a minor annoyance. However, frequent users will no doubt bookmark their most-used tables with paper or tears. I recommend this book without reservation to everyone in electronics who must understand adhesives, or make decisions about adhesives, or both.
REVIEWED BY: George Riley, FlipChips Dot Com |
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