Copper Bumps. (7k)
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Copper bumps with reflowed eutectic solder caps.
( Courtesy TMLI Corporation )
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Dipped double stud bumps. (7k)
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Stacked, dipped double gold stud bumps.
(MKPA Photo)
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Solder jet bumps. (19k)
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Jetted double solder bumps from Pac Tech SBB2.
(Pac Tech Photo)
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Thinned Wafer (14k)
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25 micrometer thinned Gallium Arsenide wafer.
(Fraunhofer-Institut IZM Photo)
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NASAPILL.jpg (25k)
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NASA implantable fetal monitor,
five flipped chips.
Board 30 mm long, 10 mm wide. (NASA Photo)
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2die.jpg
(10k) |
Closer view of two flipped chips in the
NASA fetal monitor.
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3Dmem.jpg
(10k) |
3-D RAM, with four 64 Meg chips on a
folded flex substrate.
In the foreground is a single 64
Meg packaged ram.
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1bump.jpg
(13k) |
Gold stud bump on a bond pad.
Diameter at base about 75 microns.
See Tutorial, Stud Bump Flip Chip.
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stencil1a.jpg
(13k) |
Conductive adhesive stencilled onto a bond pad.
Pad dimemensions about 75 microns.
See Tutorial, Stud Bump Flip Chip.
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dipbump1a.jpg
(13k) |
Gold stud bump after dipping in conductive adhesive.
Diameter at base about 75 microns.
See Tutorial, Stud Bump Flip Chip.
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bumpjoin.jpg (9k) |
Gold stud bump connection from chip
(top) to substrate.
Conductive adhesive around the bump,
non-conductive underfill beyond.
See Tutorial, Stud Bump Flip Chip.
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NiAuUBM.jpg
(6k) |
Electroless nickel - gold under-bump metal (UBM) on wafer.
See Archives, Tutorial 2, Solder Bump Flip Chip.
(Pac Tech Photo)
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SolderOnNiAu.jpg (4k) |
Reflowed solder bumps on electroless nickel-gold UBM.
See Archives, Tutorial 2, Solder Bump Flip Chip.
(Pac Tech Photo)
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Preform.jpg (12k) |
Molded underfill (MUF) preforms.
See Archives, Underfill Update.
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Stacked stud bumps. (9k)
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Stacked gold stud bumps, 17 high. A new world record!
Submitted by N. Ishikawa, Fujitsu Ltd.
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stack15b.jpg (12k) |
The Great Wall of Bumps, 1 to 15
(photo by N. Ishikawa, Fujitsu Ltd.)
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