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FlipChips News
-- June -
Aug 2010
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News Suppliers Consulting Tutorials Articles Literature Books Photos Newsletter Home |
Sponsor News SET to Participate in Funded Development
Sponsor SET SAS announced on May 25 their participation in an award by OSEO, the French innovation agency,
of € 9.9 million for a three year program to simplify and shorten the process of depositing copper patterns on
semiconductor wafers with better form factors and increased geometrical accuracy. Coming Events
Calls for Abstracts
Tutorial The June Tutorial 105, "Improved Surface Preparation for Failure Analysis" shows how ion beam milling has been adapted for better viewing of failure analysis samples. More than 100 tutorials are available at Tutorials. Is English your second language? Let Dr. Flipchip turn your technical papers, articles, and presentations into clear, error-free english. Polishing by a technically knowledgeable editor. |
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