|
|
|
|
|
|
|
|
|
|
|||||||||
FlipChips News -- Summer 2008
 |
|||||||||||
|
News Suppliers Consulting Tutorials Articles Literature Books Photos Newsletter BLOG Home |
Coming Events
Calls for Papers
Sponsor News SET is preparing a paper available soon detailing "Wafer Level Packaging Chip-to-Wafer Approach using Flux Less Soldering and Featuring Hermetic Seal Capabity" based upon their recent IMAPS Device Packaging Conference presentation.The Riley Report -- "The $38 Billion Blunder"Lead-free compliance has cost the electronics industry more than $38 billion to date, a total increasing by $3.7 billion annually. Read On-Line Article Tutorial This month's Tutorial , "Chip to Wafer Hermetic Cavity Sealing" briefly describes a new application of "controlled collapse"assembly recently reported by SET and CEA-LETI. More than 80 tutorials are available in Tutorials. Free White Paper "A Buyer's Guide to Flip Chip" helps you choose the right flip chip for your application. PDF (120k). Pre-Conference Abstracts Four new abstracts (6 total) are posted for SMTA International 2008:
Authors may send accepted pre-conference abstracts to DrRiley @ flipchips.com for immediate posting.Turn Tech Papers into Profits Dr. Flipchip's writing and editing services turns technical papers into profits with clear, well-written white papers. expertly crafted to your needs by a technically knowledgeable author. Let Doctor FlipChip write it for you!
|
| |||||||||
|
|
|||||||||||
|
|||||||||||