The bibliography is selective, not comprehensive. My selections cover a range of topics centered on process development and applications. I include older articles since earlier articles are sometimes a simpler introduction to complex subjects. Listings are in reverse chronological order, newest first.

BOOKS , lists recommended books on flip chips and allied technologies, with links to Reviews, Table of Contents, Sample Pages, and purchase information.

Pre-Publication Abstracts: full text available at the conference and afterwards in the Proceedings.

SMTA: full text conference articles available to SMTA members at www.smta.org

IMAPS: full text Journal articles available to IMAPS members at www.imaps.org

Advanced Packaging magazine articles cited are linked to full text articles available with others in Advanced Packaging Archives.

Other trade periodical policies vary on past articles; check web sites.

Technical libraries or on-line information services may obtain article copies.

Authors may make reprints available; inquire by email.

Mechanical properties of solder bump formed on FPCB for continuous flip chip bonding process

Sehyung Lee,  Yue-Seon Shin, Jun-Ki Kim, Sehoon Yoo   Korea Institute of Industrial Technology

SMTAI 2009   October 4-8 2009. PREPUBLICATION ABSTRACT

Imbedded Die assembly process, is it ready yet?

Jim D. Raby

SMTAI 2009   October 4-8 2009. PREPUBLICATION ABSTRACT

Wafer Level Packaging Technology Trends for CMOS Image Sensors

Andrew Perkins Swarnal Borthakur Marc Sulfridge

SMTAI 2009   October 4-8 2009. PREPUBLICATION ABSTRACT

Effect of Package Sizes and Underfill on CSP Reliability

Brian J. Toleno Tom White

SMTAI 2009   October 4-8 2009. PREPUBLICATION ABSTRACT

Challenges of Solder Bumping Capacitive Micro-Machined Ultrasonic Transducers (cMUT) Trenched Devices

Charles Woychik, Robert Wodnick, Thomas Fritzsch Oswin Ehrmann Rafael Jordan Veronika Glaw Rayette Fisher Kai Thomenius

SMTAI 2009   October 4-8 2009. PREPUBLICATION ABSTRACTS

A Comparison of Electroless and Electroplated Ni/Au UBM Structures for Board Level Reliability of WLCSP Devices

Luke England

SMTAI 2009   October 4-8 2009. PREPUBLICATION ABSTRACT

Innovative package realization by Chip Embedding Technologies

L. Boettcher D.Manessis S.Karaszkiewicz A. Ostmann H. Reichl

SMTAI 2009   October 4-8 2009. PREPUBLICATION ABSTRACT

No-Flow Underfill Voids Nucleation Study in High, Stable Yield, and Near Void-Free Assembly Process Development

Sangil Lee Daniel F. Baldwin

SMTAI 2009   October 4-8 2009. PREPUBLICATION ABSTRACT

3D Integration -- Future Perspectives

M. Jurgen Wolf Peter Ramm Herbert Reichl

SMTA Pan Pacific, February 10 - 12, 2009. PREPUBLICATION ABSTRACT

Advanced Electrodeposition Technologies for 3D Integration

Rosalia Beica and Paul Siblerud

SMTA Pan Pacific, February 10 - 12, 2009. PREPUBLICATION ABSTRACT

Copper generating process for next-generation core through-via filling

Stephen Kenny and Bernd Roelfs

SMTA Pan Pacific, February 10 - 12, 2009. PREPUBLICATION ABSTRACT

An EMS Perspective on Assembly, Rework and Reliability

Heather J. McCormick, Irene Sterian, Jimmy Chow, Mike Berry, Joel Trudell, Roden Cortero

SMTA Pan Pacific, February 10 - 12, 2009. PREPUBLICATION ABSTRACT

3D-LSI Technology for the Image Sensor Devices

Makoto Motoyoshi Hirofumi Nakamura Manabu Bonkohara

SMTA Pan Pacific, February 10 - 12, 2009. PREPUBLICATION ABSTRACT

SYSTEM-ON-WAFER BY 3D ALL SILICON SYSTEMS TECHNOLOGY

Rao Tummala Ritwik Chatterjee P. Markondeya Raj Venky Sundaram Rolf Aschenbrenner Herbert Reichl Joungho Kim.

SMTA Pan Pacific, February 10 - 12, 2009. PREPUBLICATION ABSTRACT

Cost Analysis of Electronics Manufacturing With Inkjet Technology

Taavi Saviauk Matti Mäntysalo Pauliina Mansikkamäki

SMTA International, August 17 - 19, 2008. PREPUBLICATION ABSTRACT

Assembly Yield Characterization and Void Formation Study on High I/O and Fine-Pitch Flip Chip Interconnects using No-Flow Underfill

Sangil Lee Myung Jin Yim C.P.Wong Daniel F. Baldwin Raj Master

SMTA International, August 17 - 19, 2008. PREPUBLICATION ABSTRACT

Fine Pitch Flip Chip Attach to a Flexible Carrier

Charles G. Woychik, Rayette Fisher, Robert Wodnicki, Scott Cogan, Christine Kallmayer, Barbara Pahl, Rafael Jordan, Hermann Oppermann, Thomas Fritzsch

SMTA International, August 17 - 19, 2008. PREPUBLICATION ABSTRACT

New Encapsulation process for the SiP

Tae Hyun Kim Sung Yi Dong-Kuk Kim Tae Sung Jung Ki Chan Kim Jin Su Kim

SMTA International, August 17 - 19, 2008. PREPUBLICATION ABSTRACT

A 3D-WLCSP Package Technology: Processing and Reliability Characterization

Paul Houston, Daniel F. Baldwin, Gene Stout, Ted Tessier

SMTA International, August 17 - 19, 2008. PREPUBLICATION ABSTRACT

A Via-First Approach to Fabricate Through-Silicon Vias Using Anisotropic Wet Etching of (100) Silicon Wafers

Ramachandran K. Trichur, Xie Shao

SMTA International, August 17 - 19, 2008.. PREPUBLICATION ABSTRACT

Novel Wafer Level Packages using Anisotropic Conductive Pastes (ACPs) and NCPs

Kyung-Wook Paik Il Kim Ho-Young Son Chang-Kyu Chung

SMTA Pan Pacific Symposium, January 22 - 24, 2008. PREPUBLICATION ABSTRACT

PRODUCTION OF CARBON NANOTUBE BY ELECTRIC ARC DISCHARGE METHOD

Sethu Prabhu

SMTA Pan Pacific Symposium, January 22 - 24, 2008. PREPUBLICATION ABSTRACT

Process and Assembly Methods for Increased Yield of Package on Package Devices

Brian Toleno Dan Maslyk

SMTA Pan Pacific Symposium, January 22 - 24, 2008. PREPUBLICATION ABSTRACT

Design & Features of a New 3D Interconnect for Package-on-Package Stacking: Through Package Interconnect (TPI)

Charles Lin, Nick Wang, Len Chen, Ken Chang, Andy Lim, Jerry Tan

SMTA Pan Pacific Symposium, January 22 - 24, 2008. PREPUBLICATION ABSTRACT

Assembly and Process Challenges for High Density PoP (Package-on-Package) Utilizing SOP (Solder-on-Pad) Technology

Joanna Wildhart Moody Dreiza

SMTA Pan Pacific Symposium, January 22 - 24, 2008. PREPUBLICATION ABSTRACT

µPILR™ Package Platform- A Higher Density Package-on-Package Innovation for Next Generation Electronics

Vern Solberg

SMTA Pan Pacific Symposium, January 22 - 24, 2008. PREPUBLICATION ABSTRACT

High Performance MEMS Inertial Instruments Fabricated on LTCC Substrates

Thomas F. Marinis Joseph W. Soucy Brian D. Johansson

IMAPS 2007, November 11 - 15 2007. PREPUBLICATION ABSTRACT

Assembly Technology for 3-D VLSI Chip Stacks

Leonard W. Schaper, Yang Liu, Susan Burkett, Alphonso Kamto, Gayathri Jampana

IMAPS 2007, November 11 - 15 2007. PREPUBLICATION ABSTRACT

Au to Au Thermosonic Flip Chip

Jim Clatterbaugh

IMAPS 2007, November 11 - 15 2007. PREPUBLICATION ABSTRACT

"Inside-Out" Fabrication of HDI Layers: Flush Pads With No Plating

Jim Haley, Ken Holcomb, Catherine Shearer

IMAPS 2007, November 11 - 15 2007. PREPUBLICATION ABSTRACT

Reworking Package on Package Components

Paul Wood

SMTAI 2007, October 7 - 11 2007. PREPUBLICATION ABSTRACT

Flux Compatibility Study on Flip Chip Underfills

Renzhe Zhao, Qing Ji, George Carson, Michael Todd

SMTAI 2007, October 7 - 11 2007. PREPUBLICATION ABSTRACT

Wetting angle and surface tension, Two Critical Parameters for packaging materials

Jinlin Wang

SMTAI 2007, October 7 - 11 2007. PREPUBLICATION ABSTRACT

Low Profile NAN Flash Stacked Package-on-Package

Vern Solberg

SMTAI 2007, October 7 - 11 2007. PREPUBLICATION ABSTRACT

The Development of a Single Chamber, Multi-Metal, Bump Plating Tool

Yixiang Xie, Lee Levine, Qiang Fu, Solomon Basame, Miles Prim, Doug Welter

SMTAI 2007, October 7 - 11 2007. PREPUBLICATION ABSTRACT

Process Development and Reliability Evaluation for Inline Package on Package (PoP) Assembly

Jonas Sjoberg, David A. Geiger, Todd Castello and Dr. Dongkai Shangguan

SMTAI 2007, October 7 - 11 2007. PREPUBLICATION ABSTRACT

2nd and 3rd Level Solder Joint Reliability of High-end Flip Chip SiP (System in Package)

Sang Ha Kim, Chika Kakegawa, Hiroshi Tabuchi, Han Park

SMTAI 2007, October 7 - 11 2007. PREPUBLICATION ABSTRACT

The study of laser repair through BCB passivation in flip chip technologies

Shu-Ching Ho, Hsiang-Ming Huang, Yi-Chang Lee, Yeong-Jyh Lin, An-Hong Liu

SMTAI 2007, October 7 - 11 2007. PREPUBLICATION ABSTRACT

Thermally Enhanced Flip Chip Package using Thru Package Interconnect

Charles Lin, Nick Wang, Len Chen, Ken Chang, Andy Lim, Jerry Tan, Subramaniam NR

SMTAI 2007, October 7 - 11 2007. PREPUBLICATION ABSTRACT

Assembly Yields Characterization of High IO Density, Fine Pitch Flip Chip In Package Using No-Flow Underfill

Sangil Lee Daniel Baldwin Raj Master Srinivasan Parthasarathy,

SMTAI 2007, October 7 - 11 2007. PREPUBLICATION ABSTRACT

The Impact of Solder Bump Voiding on Flip Chip Reliability

David W. Ihms Shing Yeh

SMTAI 2007, October 7 - 11 2007. PREPUBLICATION ABSTRACT

Assembly Strategies for 3D-Integration; Wafer-to-Wafer versus Chip-to-Wafer

Gilbert Lecarpentier

IMAPS Device Conference, March 19 - 2, 2007. PREPUBLICATION ABSTRACT

Plastic Air Cavity QFN Achieves True Hermetic Performance for MEMS Applications

Michael A. Zimmerman Chris Lee

IMAPS Device Conference, March 19 - 22, 2007. PREPUBLICATION ABSTRACT

Chip Embedding by Chip in Polymer Technology

Lars Boettcher H. Reichl D. Manessis Alexander Neumann A. Ostmann

IMAPS Device Conference, MMarch 19 - 22, 2007. PREPUBLICATION ABSTRACT

Assembly and Cooling Technology for 3-D VLSI Chip

Leonard W. Schaper Yang Liu Susan Burkett Li Cai

IMAPS Device Conference, March 19 - 22, 2007. PREPUBLICATION ABSTRACT

Wafer Level Packaging - Bringing Size and Performance Benefits to an Expanding Application Space

Ravi Chilukuri David Hays Glenn Rinne

IMAPS Device Conference, March 19 - 22, 2007. PREPUBLICATION ABSTRACT

Analysis of Low-K Dielectric in Flip Chip Devices Using Acoustic Micro Imaging

Janet Semmens Lawrence W. Kessler

SMTA Pan Pacific Symposium, January 30 - February 1, 2007. PREPUBLICATION ABSTRACT

A study on copper electrodepostion used for via interconnection, for the application of wafer level packaging

Seungjin Oh

SMTA Pan Pacific Symposium, January 30 - February 1, 2007. PREPUBLICATION ABSTRACT

Polyimide Based Embedding Technology for RF Structures and Active Components

W. Christiaens B. Vandevelde S. Brebels J. Vanfleteren

SMTA Pan Pacific Symposium, January 30 - February 1, 2007. PREPUBLICATION ABSTRACT

Wafer Level Package using Pre-Applied Anisotropic Conductive Films (ACFs)

Kyung-Wook Paik Ho-Young Son Chang-Kyu Chung

SMTA Pan Pacific Symposium, January 30 - February 1, 2007. PREPUBLICATION ABSTRACT

Embedding of Thinned Chips in Plastic Substrates

B. Vandecasteele J. Govaerts J. Vanfleteren

SMTA Pan Pacific Symposium, January 30 - February 1, 2007. PREPUBLICATION ABSTRACT

"Warm" Manufacturing

Alan Rae

SMTA Pan Pacific Symposium, January 30 - February 1, 2007. PREPUBLICATION ABSTRACT

Jetting Adhesives and Other Materials for Semiconductor and Electronic Component Packaging

Alec J. Babiarz

SMTA Pan Pacific Symposium, January 30 - February 1, 2007. PREPUBLICATION ABSTRACT

Unveiling the Next Generation in Substrate Technology

Ronald Huemoeller Sukianto Rusli Steve Chiang Tsung Yuan Chen Dave Baron Kuldip Johal

SMTA Pan Pacific Symposium, January 30 - February 1, 2007. PREPUBLICATION ABSTRACT

Cu-Sn Solder Sealing for Hermetic Optical MEMS Devices Package

Won Kyoung Choi, Qian Wang, Woonbae Kim, Chang Youl Moon

IMAPS 2006, October 8 - 12, 2006. PREPUBLICATION ABSTRACT

A Flip Chip Attach Method for Dense, Moderate Pin Count, High Speed (80+ Gbps) Interconnects

Wendy L. Wilkins, M. J. Lorsung, J. E. Bublitz, B. A. Randall, J. L. Fasig, B. K. Gilbert, E. S. Daniel

IMAPS 2006, October 8 - 12, 2006. PREPUBLICATION ABSTRACT

Performance of a Novel Anisotropic Conductive Adhesive under Thermal and Temperature/Humidity Aging Conditions

S. Manian Ramkumar Krishnaswami Srihari

IMAPS 2006, October 8 - 12, 2006. PREPUBLICATION ABSTRACT

Low Temperature Curing of Epoxies with Microwaves

Robert L. Hubbard I. Ahmad B. Toleno

IMAPS 2006, October 8 - 12, 2006. PREPUBLICATION ABSTRACT

Glass Transition Temperature Effects on Thermal Conductivity

John C. Frankosky

IMAPS 2006, October 8 - 12, 2006. PREPUBLICATION ABSTRACT

Nanotube Composite Processing for Property Manifestation

David Carnahan

IMAPS 2006, October 8 - 12, 2006. PREPUBLICATION ABSTRACT

Characterization of Carbon Nanotube Filled Conductive Adhesive

Jing Li Janet Lumpp

IMAPS 2006, October 8 - 12, 2006. PREPUBLICATION ABSTRACT

High Performance Gold Coated Nickel Powders for Packaging Applications in Electronics

Brian W. Callen Eric Kozcula

IMAPS 2006, October 8 - 12, 2006. PREPUBLICATION ABSTRACT

Copper Column Grid Array, A High Performance Lead-Free Alternative

R. Shih, J. Taylor, F. Billaut, M. Interrante, G. Oxx, W. Enroth, A. Mays, D. Korf

IMAPS 2006, October 8 - 12, 2006. PREPUBLICATION ABSTRACT

Nanocomposites and Nanoparticle Fluids for Microelectronic Packaging Applications

Emmanuel P. Giannelis

IMAPS 2006, October 8 - 12, 2006. PREPUBLICATION ABSTRACT

Liquid Crystal Polymer Printed Circuit Board based Opto-electronic and Electronic Packaging with Functionally Hermetic Performance

Linas Jauniskis, Brian Farrell, Andrew Harvey

IMAPS 2006, October 8 - 12, 2006. PREPUBLICATION ABSTRACT

High Temperature Electrical Shorts in Printed Wiring Boards

Aaron Der Marderosian Sr.

IMAPS 2006, October 8 - 12, 2006. PREPUBLICATION ABSTRACT

High Reliability Testing for Flip Chip Gold to Gold Interconnect

Philip Couts

IMAPS 2006, October 8 - 12, 2006. PREPUBLICATION ABSTRACT

Advanced Cleaning Fluid Design and Process for Cleaning Flip Chip Packages

Mike Bixenman

IMAPS 2006, October 8 - 12, 2006. PREPUBLICATION ABSTRACT

Investigating the Lead Free Manufacturing Process

Rita Mohanty, Joe Belmonte

IMAPS 2006, October 8 - 12, 2006. PREPUBLICATION ABSTRACT

An Evaluation of Wafer Bumping Stencils Based on Solder Transfer Ratios and Predicted Bump Heights

Scott F. Popelar, Robert A. Niemet

IMAPS 2006, October 8 - 12, 2006. PREPUBLICATION ABSTRACT

Sub Micron Cleaning of Microelectronic Devices

Charlotte Frederick, Don Gray

IMAPS 2006, October 8 - 12, 2006. PREPUBLICATION ABSTRACT

Electroless Nickel-Gold Flip Chip and CSP Reliability

A. Strandjord, M.Tsai, M. Johnson, H. Lu, D. Lawhead, R. Yassie

IMAPS 2006, October 8 - 12, 2006. PREPUBLICATION ABSTRACT

Direct Cu-Cu Thermo-Compression Bonding for 3D-Stacked IC Integration

Serguei Stoukatch, Koen De Munck, Wouter Ruythooren, Piet De Moor, Deniz Sabuncuogly Tezcan, Bart Swinnen

IMAPS 2006, October 8 - 12, 2006. PREPUBLICATION ABSTRACT

New IC Packaging Structures for System in Package Applications

Joseph Fjelstad, Kevin Grundy, Gary Yasumura

IMAPS 2006, October 8 - 12, 2006. PREPUBLICATION ABSTRACT

Studbump Interconnects for High-power LED Assembly

Shatil Haque, Young-Keat Beh, Nooralshikin Hussain, Mooi Guan Ng, Seck Hoe Wong, Kok Hong Tan, Bob Steward, Paul Martin, Gilles Abrahamse

IMAPS 2006, October 8 - 12, 2006. PREPUBLICATION ABSTRACT

Practical 3D System-in-Package Solution for Mixed IC Technology Applications

Vern Solberg

IMAPS 2006, October 8 - 12, 2006. PREPUBLICATION ABSTRACT

Geometry and Bond Improvements for Wire Ball Bonding and Ball Bumping

Daniel D. Evans, Jr.

IMAPS 2006, October 8 - 12, 2006. PREPUBLICATION ABSTRACT

C4NP - First Manufacturing & Reliability Data

Klaus Ruhmer, Eric Laine, Peter Gruber, Dietrich Toennies, Emmett Hughlett

IMAPS 2006, October 8 - 12, 2006. PREPUBLICATION ABSTRACT

New Wire Bonding Loops for Stacked Die Packages

Lee Levine, Bob Chylak, Stephen Babinetz, O.D. Kwon

IMAPS 2006, October 8 - 12, 2006. PREPUBLICATION ABSTRACT

Au Stud Bumping for Wafer Probe Testing

Jamin Ling, Bob Werner, Luis Morales

IMAPS 2006, October 8 - 12, 2006. PREPUBLICATION ABSTRACT

Enabling High Density System in Package (SiP) Manufacturing and Consumer Electronic Devices through the use of Jetting Technology to Minimize Substrate Area for Underfill

Michael Peterson Steven J. Adamson

SMTAI 2006, September 24 - 28 2006. PREPUBLICATION ABSTRACT

Effects of Plasma Pretreatment on Flip Chip and CSP Substrate Level Assembly Yield and Reliability

Daniel Baldwin

SMTAI 2006, September 24 - 28 2006. PREPUBLICATION ABSTRACT

Electromigration in Flip-chip SnPb Solder Joints with thick Ni/Cu UBM

C.H. Chen Chih Chen Eric Lin Yi-Cheng Liu Paul Chen

SMTAI 2006, September 24 - 28 2006. PREPUBLICATION ABSTRACT

Qualitative evaluation of flip chip solder bumps produced by stencil printing of solder paste on variable Electroless Ni/Au metallizations

D.Manessis L. Boettcher R. Patzelt B. Schild A. Ostmann R. Aschenbrenner H. Reichl

SMTAI 2006, September 24 - 28 2006. PREPUBLICATION ABSTRACT

Thermo-Mechanical Reliability of Flip-Chip Devices on Metal-Backed Flex Circuits

Sandesh Rupati Pradeep Lall

SMTAI 2006, September 24 - 28 2006. PREPUBLICATION ABSTRACT

Bump Free Flip Chip Assembly using Embedded Chip Technology

C. Woychik, R. Fillion, J. Simpson, J. Zhang, K. Durocher, E. Burke

SMTAI 2006, September 24 - 28 2006. PREPUBLICATION ABSTRACT

Effect of Bumped Wafer Shelf Life on Yield, Quality and Reliability of Flip Chip BGA Packages

Mukul Joshi Kumar Nagarajan

SMTAI 2006, September 24 - 28 2006. PREPUBLICATION ABSTRACT

A New Methodology to Predict and Minimize Molten Solder Joint Opens and Shorts During Reflow

Mudasir Ahmad Ken Hubbard Sue Teng

SMTAI 2006, September 24 - 28 2006. PREPUBLICATION ABSTRACT

Fast Flow Capillary Underfills for High Throughput Assemblies

Timothy Adams Brian Wheelock Paul Morganelli Vinod Mohan

SMTAI 2006, September 24 - 28 2006. PREPUBLICATION ABSTRACT

Electrical Interconnects for 3D Wafer Stacks

Praveen Pandojirao-Sunkojirao,Ping Zhang, Rachita Dewan, Dan O. Popa, Harry E. Stephanou, J.-C. Chiao

IMAPS Device Conference, March 21 - 23, 2006. PREPUBLICATION ABSTRACT

Next Generation Low Stress Plastic Cavity Package for Sensor Applications

Dr. Michael A. Zimmerman

IMAPS Device Conference, March 21 - 23, 2006. PREPUBLICATION ABSTRACT

Geometry and Bond Improvements for Wire Ball Bonding and Ball Bumping

Daniel D. Evans, Jr.

IMAPS Device Conference, March 21 - 23, 2006. PREPUBLICATION ABSTRACT

Production Feasiblity of Electrodeposition of Tin-Silver-Copper for Wafer Bump Applications

Rozalia Beica, Eric Chiu, Angelo Chirafisi

IMAPS Device Conference, March 21 - 23, 2006. PREPUBLICATION ABSTRACT

Investigations of Anodic Bonding for MEMS Wafer Level Package Applications

Hsueh-Kuo Liao, Hsieh-Shen Hsieh, Cheng-Chang Lee, Hwang-Kuen Chen, Tai-Kang Shing

IMAPS Device Conference, March 21 - 23, 2006. PREPUBLICATION ABSTRACT

Direct Bonding of SU-8 Cavities over MEMS Components

Donald W. Johnson, Milind P. Nagale, Joseph Molea, Michael Hornung, Volkan Cetin

IMAPS Device Conference, March 21 - 23, 2006. PREPUBLICATION ABSTRACT

Fluxless Soldering for Hermetic Packaging of MOEMS

Abiodun Fasoro, Dan O. Popa, Amit Patil, Woo Ho Lee, Jeongsik Sin, Heather Beardsley, Harry E. Stephanou, Dereje Agonafer

IMAPS Device Conference, March 21 - 23, 2006. PREPUBLICATION ABSTRACT

Direct Wafer Bonding Technology Applied to 3D Integration On Silicon

L. Di Cioccio, B. Charlet, B. Biasse, M. Kostrzewa, M. Zussy, J. Dechamp, M. Migette, M. Vinet, C. Lagaye, B. Aspar, J. M. Fedeli, T. Poiroux, R. Guerrieri, R. Canegallo, N. Kernevez

IMAPS Device Conference, March 21 - 23, 2006. PREPUBLICATION ABSTRACT

System in Package Combining Flip Chip Bonding and 3-D Stacking using a Highly Flexible Device Bonder

Gilbert Lecarpentier, Serguei Stoukatch

IMAPS Device Conference, March 21 - 23, 2006. PREPUBLICATION ABSTRACT

C4NP - First Manufacturing & Reliability Data for High-End FlipChip Solder Bumping Based on IBM's C4NP Process

Klaus Ruhmer, Emmett Hughlett, Dietrich Toennies, Peter Gruber

IMAPS Device Conference, March 21 - 23, 2006. PREPUBLICATION ABSTRACT

Wafer Level Temporary Bonding/Debonding for Thin Wafer Handling Applications

Koen De Munck, Lieve Bogaerts, Deniz S. Tezcan, Piet De Moor, Bart Swinnen, Kris Baert, Chris Van Hoof

IMAPS Device Conference, March 21 - 23, 2006. PREPUBLICATION ABSTRACT

A New Breed of High Volume Wafer Processing Equipment - In Situ Aligned Wafer Bonding Systems for 3D Integration

Gilbert Lecarpentier, Klaus Ruhmer, Dan Pascual

IMAPS Device Conference, March 21 - 23, 2006. PREPUBLICATION ABSTRACT

Assembly and Reliability of Ultrathin Flip Chips on Flexible Substrates

Barbara Pahl, Christine Kallmayer, Rolf Aschenbrenner, Herbert Reichl

IMAPS Device Conference, March 21 - 23, 2006. PREPUBLICATION ABSTRACT

Liquid Crystal Polymer Molded QFN Package for Microwave and Millimeter Wave Applications

Kunia Aihara, John W. Roman

IMAPS Device Conference, March 21 - 23, 2006. PREPUBLICATION ABSTRACT

MEMS Inertial Sensors and Wafer-Level Packaging

C. H. Yun, T. Lor, J. Villarreal

IMAPS Device Conference, March 21 - 23, 2006. PREPUBLICATION ABSTRACT

High Speed Electrodeposition of Lead-Free Solder Bumps for Wafer Level Packaging

Zhen Liu, Jim (Zhongqin) Zhang, Bill Wu, Arthur Keigler

IMAPS Device Conference, March 21 - 23, 2006. PREPUBLICATION ABSTRACT

Liquid Crystal Polymer (LCP) based Opto and Electronic Packaging with Functionally Hermetic Performance

Linas Jauniskis

IMAPS Device Conference, March 21 - 23, 2006. PREPUBLICATION ABSTRACT

Evaluation of a Low-Temperature Glass Frit for Wafer-Level Packaging

Daniel Pascual

IMAPS Device Conference, March 21 - 23, 2006. PREPUBLICATION ABSTRACT

Integrated Passives: An Enabling Technology for 3-D Electronics

Leonard W. Schaper

IMAPS Device Conference, March 21 - 23, 2006. PREPUBLICATION ABSTRACT

The Thermal Properties of WLCSP Solder Attach

Dennis Lang

SMTA Pan Pacific Symposium January 17 - 19, 2006. PREPUBLICATION ABSTRACT

Improved reliability of hi-Q RF filters (SAW & BAW) for RF SiP (System-in-Package) modules

Andrew Kay

SMTA Pan Pacific Symposium January 17 - 19, 2006. PREPUBLICATION ABSTRACT

3D packaging enabled with electrochemical deposition techniques from varied electronic industry segments

Dan Schmauch Bioh Kim Tom Ritzdorf

SMTA Pan Pacific Symposium January 17 - 19, 2006. PREPUBLICATION ABSTRACT

Thin film measurement and outgassing study of adhesives used in optical MEMS devices

Vijay Sundermurthy

SMTA Pan Pacific Symposium January 17 - 19, 2006. PREPUBLICATION ABSTRACT

Reliability of chip on chip packages using thermo-compression bonding technology between Au plating bumps

Masamoto Tago

SMTA Pan Pacific Symposium January 17 - 19, 2006. PREPUBLICATION ABSTRACT

Ink-Jet as a MEMS Manufacturing Tool

David Wallace Donald Hayes Ting Chen Virang Shah Delia Radulescu Patrick Cooley Michael Grove Kurt Wachtler Arunkumar Nallani

SMTA Pan Pacific Symposium January 17 - 19, 2006. PREPUBLICATION ABSTRACT

C4NP: Lead-free & Low Cost Solder Bumping Technology headed for Production

Klaus Ruhmer Dietrich Toennies Emmett Hughlett Peter Gruber

SMTA Pan Pacific Symposium January 17 - 19, 2006. PREPUBLICATION ABSTRACT

Conductive Ink Jettable Metal and Nonmetal Nanosystems<

Alan Rae

SMTA Pan Pacific Symposium January 17 - 19, 2006. PREPUBLICATION ABSTRACT

Processing and Reliability of High Performance Flip Chip on Flex Modules

Daniel F. Baldwin

SMTA Pan Pacific Symposium January 17 - 19, 2006. PREPUBLICATION ABSTRACT

Advances in Jetting Small Dots of High Viscosity Fluids for Electronic and Semiconductor Packaging

Alec J. Babiarz

SMTA Pan Pacific Symposium January 17 - 19, 2006. PREPUBLICATION ABSTRACT

Three dimensional heterogeneous chip integration process

David Scheid

SMTA Pan Pacific Symposium January 17 - 19, 2006. PREPUBLICATION ABSTRACT

Flexible Circuit Attach Process for Camera Module

Asif Chowdhury

SMTA Pan Pacific Symposium January 17 - 19, 2006. PREPUBLICATION ABSTRACT

Scaling up RFID Manufacturing

Gerald Steinwasser

IWLPC San Jose, California, November 3 - 4, 2005. PREPUBLICATION ABSTRACT

3D Packaging via Advanced-Chip-to-Wafer (AC2W) bonding enables hybrid System-in-Package (SiP) Integration

Stefan Pargfrieder Thorsten Matthias Christian Schaefer Markus Wimplinger Christoph Scheiring Hannes Kostner

IWLPC San Jose, California, November 3 - 4, 2005. PREPUBLICATION ABSTRACT

Wafer-level-packaging, 3D integration and wafer-level layer transfer processes through aligned wafer bonding

Thorsten Matthias Markus Wimplinger Paul Lindner Helge Luesebrink

IWLPC San Jose, California, November 3 - 4, 2005. PREPUBLICATION ABSTRACT

A practical eutectic gold-tin electroplating process

Dr. George Hradil

IWLPC San Jose, California, November 3 - 4, 2005. PREPUBLICATION ABSTRACT

Electronics on Deformable Ultra-Thin Substrates	Marian Bartek	IWLPC San Jose, California, November 3 - 4, 2005. PREPUBLICATION ABSTRACT
MEMS Wafer-Level Processes	Ken Gilleo	IWLPC San Jose, California, November 3 - 4, 2005. PREPUBLICATION ABSTRACT
Post-process silicon through vias technology with low electrical resistance	David Henry J-C. Souriau C. Brunet-Manquat C. Puget, O. Fanget A. Hassaine N. Sillon	IWLPC San Jose, California, November 3 - 4, 2005. PREPUBLICATION ABSTRACT
Electroplating of Lead-free Bumps for WLP Applications	R. Kiumi, N. Saito F. Kuriyama J. Yoshioka S. Takeda, Y. Saijo	IWLPC San Jose, California, November 3 - 4, 2005. PREPUBLICATION ABSTRACT
Development of Assembly Process for Ultra Fine Pitch Wafer Level Packaging	Suh Sung-Min	IWLPC San Jose, California, November 3 - 4, 2005. PREPUBLICATION ABSTRACT
C4NP lead-free and low cost solder bumping technology heads for production.	Dietrich Toennies Emmett Hughlett Klaus Ruhmer Peter Gruber	IWLPC San Jose, California, November 3 - 4, 2005. PREPUBLICATION ABSTRACT
Micro-Post Assembly Process	Nabil Homsy First Level, Inc.	IMAPS International Symposium Philadelphia, PA Sept 25 - 29, 2005 . PREPUBLICATION ABSTRACT
Thermosonic Bonding of High Pin Count Flip Chips on Flexible Substrates	Gerard Kums J. van Delft H. de Vries	IMAPS International Symposium Philadelphia, PA Sept 25 - 29, 2005 . PREPUBLICATION ABSTRACT
Interconnect Technologies for RFID Assembly	Boa Xia Jaresh Shah Chig-Min Cheng Wanda O'Hara Vito Buffa	IMAPS International Symposium Philadelphia, PA Sept 25 - 29, 2005 . PREPUBLICATION ABSTRACT
Thermosonic Flip Chip Bonding for High Power LED Packages	Charles C-H Pang Hing-Suen Siu Chi-Kong Law Hon-Chiu Hui Kin-Yik Hung	IMAPS International Symposium Philadelphia, PA Sept 25 - 29, 2005 . PREPUBLICATION ABSTRACT
Thin Substrate Flip Chip Assembly - Managing Substrate Warp Through Controlled Thermal Process	Shichun Qu Robin E. Gorrell	IMAPS International Symposium Philadelphia, PA Sept 25 - 29, 2005 . PREPUBLICATION ABSTRACT
Assessing UBM Reliability at Wafer Level	Jianxing Li, Jeff Coleman, Jorge Valdez, Caroline Merrill	IMAPS International Symposium Philadelphia, PA Sept 25 - 29, 2005 . PREPUBLICATION ABSTRACT
Micromachined Accelerometer Performance in Plastic Overmold Packages	Changhan Hobie Yun X. Zhang W. A. Webster T.Lor E. Lacsamana	IMAPS International Symposium Philadelphia, PA Sept 25 - 29, 2005 . PREPUBLICATION ABSTRACT
Hermetic Sealing of MEMS by Liquid-Phase Alloying of Indium with Silver	Gustina B. Collins Sanjay Raman Guo-Quan Lu	IMAPS International Symposium Philadelphia, PA Sept 25 - 29, 2005 . PREPUBLICATION ABSTRACT
Gold Bump Technologies	Mark Greenwell	SMTA International 2005 Chicago, IL, September 25-29, 2005. PREPUBLICATION ABSTRACT
Flip Chip Ultrasonic Gold to Gold Interconnect for High Bump Count Devices	Philip Couts	SMTA International 2005 Chicago, IL, September 25-29, 2005. PREPUBLICATION ABSTRACT
Adhesive Flip Chip for Large Arrayed Devices	James Clayton	SMTA International 2005 Chicago, IL, September 25-29, 2005. PREPUBLICATION ABSTRACT
Packaging of High-power LEDs using Au Studbump Interconnects	Shatil Haque Mooi Guan Ng Gilles Abrahamse Frank Wall Serge Rudaz Paul S. Martin	SMTA International 2005 Chicago, IL, September 25-29, 2005. PREPUBLICATION ABSTRACT
Paradigm Shift in Applying Underfill	Alec J. Babiarz	SMTA International 2005 Chicago, IL, September 25-29, 2005. PREPUBLICATION ABSTRACT
Process and design considerations for performing high volume Pb-free flip chip on flex assemblies with a six sigma focus.	Michael Peterson	SMTA International 2005 Chicago, IL, September 25-29, 2005. PREPUBLICATION ABSTRACT
Effect of Cleaning Process Parameters and Materials on Flux Residue for Flip Chip Assembly	Vivekanand Venkataraman, Son Tran, Mike Vincent Robert Murcko K. Srihari	SMTA International 2005 Chicago, IL, September 25-29, 2005. PREPUBLICATION ABSTRACT
A Study of the Failure Mechanisms in Lead Free and Eutectic Solder Bumps for Flip Chip Assembly	Julia Zhao, David Mackessy, John Jackson	SMTA International 2005 Chicago, IL, September 25-29, 2005. PREPUBLICATION ABSTRACT
Application of a Near Infrared Defect Inspection Process for Flip Chip Assembly	L. Todd Woods Steve J. Olson, PhD, Alex F. Schreiner, PhD	SMTA International 2005 Chicago, IL, September 25-29, 2005. PREPUBLICATION ABSTRACT
The Effect of Cooling Rate on the Shear Strength of Lead-Free Flip Chip Assemblies using No Flow Underfill	Fred C. Dimock, Kristen M. Mattson, Wusheng Yin, Ph.D, Ning-Chen Lee, Ph.D	SMTA International 2005 Chicago, IL, September 25-29, 2005. PREPUBLICATION ABSTRACT
Fillet Wetting and Die Collapse of Wafer-Level Flip Chip Assemblies	Stephen C. Busch Daniel F. Baldwin, PhD	SMTA International 2005 Chicago, IL, September 25-29, 2005. PREPUBLICATION ABSTRACT
Effect of Unfilled Underfill on Board Level Reliability	Karl Loh	SMTA International 2005 Chicago, IL, September 25-29, 2005. PREPUBLICATION ABSTRACT
In Situ Stress Analysis and Reliability Assessment of Flip Chip on Organic Board Using Power Cycling Techniques	Jian Zhang Daniel F. Baldwin	IMAPS Flip Chip Topical Workshop Austin, Texas, June 20 - 23. PREPUBLICATION ABSTRACT
Near Void Free Hybrid No-Flow Underfill Flip Chip Process Technology	Michael Colella Daniel Baldwin	IMAPS Flip Chip Topical Workshop Austin, Texas, June 20 - 23. PREPUBLICATION ABSTRACT
Design Guidelines for Fine Pitch Flip Chip Production	Haluk Balkan Jacinta Aman Lim Dan Berry Guy Burgess	IMAPS Flip Chip Topical Workshop Austin, Texas, June 20 - 23. PREPUBLICATION ABSTRACT
Fine Pitch Solder Stencil Printing using Low Cost Electroless Ni/Au UBM for Memory Devices	Thorsten Teutsch Axel Scheffler Elke Zakel Carlo Gamboa Bo Chang	IMAPS Flip Chip Topical Workshop Austin, Texas, June 20 - 23. PREPUBLICATION ABSTRACT
Assembly and Reliability of Lead-free Flip Chip Devices with a Nanofilled No-flow Underfill Material	Ananth Prabhakumar Donald Buckley Arun Chaudhuri Frank Stepniak Paul Gillespie Ryan Mills Slawomir Rubinsztajn Sandeep Tonapi	IMAPS Flip Chip Topical Workshop Austin, Texas, June 20 - 23. PREPUBLICATION ABSTRACT
An innovative approach to low cost, high performance, lead-free DCA	Elwyn Wakefield George Riley	IMAPS Flip Chip Topical Workshop Austin, Texas, June 20 - 23. PREPUBLICATION ABSTRACT
C4NP: New Solder Bumping Technology - Low Cost & Lead Free	Dietrich Tönnies Emmett Hughlett Klaus Ruhmer Peter Gruber	IMAPS Flip Chip Topical Workshop Austin, Texas, June 20 - 23. PREPUBLICATION ABSTRACT
Low Profile Flat Top Ball Bumps for Next Generation 1st Level Interconnect	Daniel D. Evans	IMAPS Flip Chip Topical Workshop Austin, Texas, June 20 - 23. PREPUBLICATION ABSTRACT
Chemical Resistance of Polyimide Passivations in Wafer-Level Photoresist Stripping Processes	Raymond Chan Diane Scheele Thomas Goodman	IMAPS Flip Chip Topical Workshop Austin, Texas, June 20 - 23. PREPUBLICATION ABSTRACT
Electroplating Tin-Silver Solder Bumps for Wafer Level Packaging	Zhongqin (Jim) Zhang Zhen Liu Arthur Keigler	IMAPS Flip Chip Topical Workshop Austin, Texas, June 20 - 23. PREPUBLICATION ABSTRACT
Gold Bump Technologies:Plating versus Ball	Daniel Evans, Jr.	IMAPS Device Packaging Conference Mar. 13 - 16, 2005, Scottsdale, Arizona. PREPUBLICATION ABSTRACT
A liquid crystal polymer printed circuit board based packaging platform for highly integrated devices	Linas Jauniskis and Brian Farrell	IMAPS Device Packaging Conference Mar. 13 - 16, 2005, Scottsdale, Arizona. PREPUBLICATION ABSTRACT
Near Hermetic Liquid Crystal Polymer Air Cavity Packaging for Microwave, MEMS and Optical Applications	John W. Roman and David L. Dewire	IMAPS Device Packaging Conference Mar. 13 - 16, 2005, Scottsdale, Arizona. PREPUBLICATION ABSTRACT
3D Package Innovations for Enabling System Level Integration and Miniaturization	Vern Solberg	IMAPS Device Packaging Conference Mar. 13 - 16, 2005, Scottsdale, Arizona. PREPUBLICATION ABSTRACT
Fully automatic multi-process assembly of an optical silicon bench at sub-micron accuracy: a new route of precision optical packaging techniques.	Gilbert Lecarpentier Bertrand Paris Stéphane Rabaron	IMAPS Device Packaging Conference Mar. 13 - 16, 2005, Scottsdale, Arizona. PREPUBLICATION ABSTRACT
Processing and Reliability of No Flow Underfills and the Influence of Underfill Voids	Daniel F. Baldwin	IMAPS Device Packaging Conference Mar. 13 - 16, 2005, Scottsdale, Arizona. PREPUBLICATION ABSTRACT
100 Newton Ultrasonic Bond Head for Flip Chip Device Bonding	Philip Couts	IMAPS Device Packaging Conference Mar. 13 - 16, 2005, Scottsdale, Arizona. PREPUBLICATION ABSTRACT
Low Temperature Curing of Polymer Films for Wafer Level Packaging	Robert L. Hubbard, PhD	IMAPS Device Packaging Conference Mar. 13 - 16, 2005, Scottsdale, Arizona. PREPUBLICATION ABSTRACT
Stud Bumping for Flip Chip - An Alternative Strategy	Jamin Ling, Matt Meyer, Matt Osborne, Vincent McTaggart	IMAPS Device Packaging Conference Mar. 13 - 16, 2005, Scottsdale, Arizona. PREPUBLICATION ABSTRACT
Factors Limiting the Electrodeposition Rate of Various Bumps for Flip Chip Interconnects	Bioh Kim, Bob Batz, Tom Ritzdorf	IMAPS Device Packaging Conference Mar. 13 - 16, 2005, Scottsdale, Arizona. PREPUBLICATION ABSTRACT
Field Tests of A Developmental Fiber Technology	Kim Abbett	SMTA Pan-Pacific Microelectronics Symposium Jan 25 - 27, 2005, Kauai, Hawaii. PREPUBLICATION ABSTRACT
Electroless Nickel / Immersion Gold Process Technology for Improved Ductility of Flex and Rigid-Flex Applications	K. Johal, H. Roberts, S. Lamprecht, C. Wunderlich	SMTA Pan-Pacific Microelectronics Symposium Jan 25 - 27, 2005, Kauai, Hawaii. PREPUBLICATION ABSTRACT
Material Design for the Next Generation Low-k/Cu Flip-Chip Packages	M. Todd, G. Carson, S. Rajagopalan, K. Desai	SMTA Pan-Pacific Microelectronics Symposium Jan 25 - 27, 2005, Kauai, Hawaii. PREPUBLICATION ABSTRACT
A Novel Low Cost, High Performance Thermally and Electrically Conductive Adhesive	Fritz Byle	SMTA Pan-Pacific Microelectronics Symposium Jan 25 - 27, 2005, Kauai, Hawaii. PREPUBLICATION ABSTRACT
Improved final manufacturing and test for Wafer Level Packaging	Bob Fenton	SMTA Pan-Pacific Microelectronics Symposium Jan 25 - 27, 2005, Kauai, Hawaii. PREPUBLICATION ABSTRACT
A Novel Adhesive for IC Packaging	Dr. Michael Kropp Andrew Behr	SMTA Pan-Pacific Microelectronics Symposium Jan 25 - 27, 2005, Kauai, Hawaii. PREPUBLICATION ABSTRACT
3D packaging by wafer through hole and chip to chip stacking	Chien-Wei Chien	SMTA Pan-Pacific Microelectronics Symposium Jan 25 - 27, 2005, Kauai, Hawaii. PREPUBLICATION ABSTRACT
Underfill Technology for Encapsulation of Large, Densely Populated Die with Small Gap for Advanced Flip Chip Packaging	Kaylan Ghosh	SMTA Pan-Pacific Microelectronics Symposium Jan 25 - 27, 2005, Kauai, Hawaii. PREPUBLICATION ABSTRACT
Low temperature assembly through nanotechnology	Alan Rae	SMTA Pan-Pacific Microelectronics Symposium Jan 25 - 27, 2005, Kauai, Hawaii. PREPUBLICATION ABSTRACT
Influence of Dielectric Materials and Via Geometry on the Thermomechanical Behavior of Silicon Through Interconnects	Mario Gonzalez Riet Labie Bart Vandevelde Eric Beyne	SMTA Pan-Pacific Microelectronics Symposium Jan 25 - 27, 2005, Kauai, Hawaii. PREPUBLICATION ABSTRACT
Paradigm Shift in Applying Underfill	Alec J. Babiarz	SMTA Pan-Pacific Microelectronics Symposium Jan 25 - 27, 2005, Kauai, Hawaii. PREPUBLICATION ABSTRACT
Plasma Treatment for Underfill Process in Flip Chip Packaging	James D. Getty Jack Zhao	SMTA Pan-Pacific Microelectronics Symposium Jan 25 - 27, 2005, Kauai, Hawaii. PREPUBLICATION ABSTRACT
Aligned Wafer Bonding for 3D Interconnect Technologies	Thorsten Matthias	SMTA Pan-Pacific Microelectronics Symposium Jan 25 - 27, 2005, Kauai, Hawaii. PREPUBLICATION ABSTRACT
Desmear Uniformity Technology in a Plasma Process	Lou Fierro	IMAPS International 2004 Nov. 14 - 18, 2004 Long Beach, CA. PREPUBLICATION ABSTRACT
Development of Ultra-Thin Flip Chip Assemblies for Low Profile SiP Applications	C. V. Banda D. J. Mountain H. K. Charles J. S. Lehtonen A. C. Keeney R. W. Johnson T. Zhang Z. Hou	IMAPS International 2004 Nov. 14 - 18, 2004 Long Beach, CA. PREPUBLICATION ABSTRACT
Characterization and Reliability Performance of an Advanced Underfill Encapsulant for Lead-Free Flip Chip	Kalyan Ghosh	SMTA International Sept. 26 - 30, 2004 Chicago, IL PREPUBLICATION ABSTRACT
Solder Joint Reliability of Eutectic and Lead-Free Flip Chip Packages	David Hillman	SMTA International Sept. 26 - 30, 2004 Chicago, IL PREPUBLICATION ABSTRACT
A Comparison of Epoxy and Cyanate Ester Underfills for FCOB Assembly	Paul Morganelli	SMTA International Sept. 26 - 30, 2004 Chicago, IL PREPUBLICATION ABSTRACT
Assembly and Reliability of Area Array Flip Chips with Filled, No-Flow Underfill	Sandeep Tonapi	SMTA International Sept. 26 - 30, 2004 Chicago, IL PREPUBLICATION ABSTRACT
Flip-Chip Underfill and Solder Paste Residue Interaction in a Pb-free Process	Brian J. Toleno, George Carson, Michael Todd	SMTA International Sept. 26 - 30, 2004 Chicago, IL PREPUBLICATION ABSTRACT
Jet Dispensing Underfills for Stacked Die Applications	Steven J. Adamson	SMTA International Sept. 26 - 30, 2004 Chicago, IL PREPUBLICATION ABSTRACT
Accelerated Testing of Flip Chip Underfills and the Effect of Moisture and Temperature on the Aging of Underfills	R. Chaware N. Vichare P. Borgesen D. Blass K. Srihari	SMTA International Sept. 26 - 30, 2004 Chicago, IL PREPUBLICATION ABSTRACT
A New High Performance Organic Substrate	Robin Gorrell Duy Le-Huu Shichun Qu Donald Banks	SMTA International Sept. 26 - 30, 2004 Chicago, IL PREPUBLICATION ABSTRACT
Jet Dispensing of Fluxes for Flip Chip Attachment and Measurement Methods for Ensuring Consistent Flux Coating	Steven Adamson Steve Heveron-Smith	IMAPS Flipchip 2004 Workshop June 21 - 24, 2004 Austin, TX PREPUBLICATION ABSTRACT
Ultrasonic Flipchip: The GREEN, Low Cost Alternative	Roberto Gilardoni	IMAPS Flipchip 2004 Workshop June 21 - 24, 2004 Austin, TX PREPUBLICATION ABSTRACT
High Speed Through-mask Copper Electrodeposition for Bumping Process	Zhenqiu Liu Bill (Qunwei) Wu Arthur Keigler John Harrell	IMAPS Flipchip 2004 Workshop June 21 - 24, 2004 Austin, TX PREPUBLICATION ABSTRACT
Low Cost Wafer Bumping for Power Electronics Device Interconnection	Thorsten Teutsch	IMAPS Flipchip 2004 Workshop June 21 - 24, 2004 Austin, TX PREPUBLICATION ABSTRACT
Thin Substrate Flip Chip Assembly Challenges	Shichun Qu Daniel J. Foster Donald R. Banks Robin E. Gorrell	IMAPS Flipchip 2004 Workshop June 21 - 24, 2004 Austin, TX PREPUBLICATION ABSTRACT
Gold to Gold Interconnect Ultrasonic Flip Chip Bonding	Philip Couts Tsunishia Nishioke	IMAPS Flipchip 2004 Workshop June 21 - 24, 2004 Austin, TX PREPUBLICATION ABSTRACT
Development of Test Chip for Electro-Migration Measurements in Flip Chip Connection	Riet Labie Tomas Webers Eric Beyne	IMAPS Flipchip 2004 Workshop June 21 - 24, 2004 Austin, TX PREPUBLICATION ABSTRACT
Characterization of Reaction Rates and Intermetallic Phase Formation for Ni and NiV UBM Layers with Eutectic SnPb and Lead-Free SnAg Solders	Kathy O'Donnell D. Gupta P. Silberud C. Lopper M. Topper	IMAPS Flipchip 2004 Workshop June 21 - 24, 2004 Austin, TX PREPUBLICATION ABSTRACT
High Currents in WL-CSPs: Controlling Electromigration	Glenn Rinne	IMAPS Flipchip 2004 Workshop June 21 - 24, 2004 Austin, TX PREPUBLICATION ABSTRACT
Advanced Wafer-Level Cleaning for Advanced WLP and Flip Chip	Diane Scheele Donn Detzler Thomas Goodman Peter Elenius	IMAPS Flipchip 2004 Workshop June 21 - 24, 2004 Austin, TX PREPUBLICATION ABSTRACT
Lead-Free Assembly: What’s So Different About Flip Chip?	Peter Borgesen	IMAPS Workshop on Military, Aerospace, Space, & Homeland Security March 28-30, 2004 Baltimore, MD PREPUBLICATION ABSTRACT
Lead-free Implementation: Drop-In Soldering Manufacturing	Dr. Jennie Hwang	APEX IPC Printed Circuits Expo Feb. 24-26, 2004 Anaheim, CA PREPUBLICATION ABSTRACT
Jetting of Underfill and Encapsulants for High-Speed Dispensing in Tight Spaces	Steven J. Adamson	APEX IPC Printed Circuits Expo Feb. 24-26, 2004 Anaheim, CA PREPUBLICATION ABSTRACT
Effect of Lead-Free Alloys on Voiding at Microvia	Dr. Arnab Dasgupta Dr. Benlih Huang Dr. Ning-Cheng Lee	APEX IPC Printed Circuits Expo Feb. 24-26, 2004 Anaheim, CA PREPUBLICATION ABSTRACT
Conquer Tombstoning in Lead-Free Soldering	Dr. Benlih Huang Dr. Ning-Cheng Lee	APEX IPC Printed Circuits Expo Feb. 24-26, 2004 Anaheim, CA PREPUBLICATION ABSTRACT
Stencil Design and Performance for Flip Chip / Wafer Bumping	William E. Coleman Ph.D.	APEX IPC Printed Circuits Expo Feb. 24-26, 2004 Anaheim, CA PREPUBLICATION ABSTRACT
Improved electrical properties of epoxy molding compound and circuit board materials using halogen-free flame retardant systems	Alan Rae	APEX IPC Printed Circuits Expo Feb. 24-26, 2004 Anaheim, CA PREPUBLICATION ABSTRACT
Harsh Environment Versus Environmentally-Friendly Electronics	Alan Rae	APEX IPC Printed Circuits Expo Feb. 24-26, 2004 Anaheim, CA PREPUBLICATION ABSTRACT
Non-Telecom Optoelectronics	Alan Rae	APEX IPC Printed Circuits Expo Feb. 24-26, 2004 Anaheim, CA PREPUBLICATION ABSTRACT
Considerations in High Volume Flip Chip Manufacturing	Lou Nicholls	SMTA Pan Pacific Hawaii Feb. 10-12, 2004 PREPUBLICATION ABSTRACT
New underfill adhesive for Flip Chip BGA	Nobuhiro Imaizumi	SMTA Pan Pacific Hawaii Feb. 10-12, 2004 PREPUBLICATION ABSTRACT
Simulation Technology for Prediction Lifetime of Flip Chip Interconnection	Yasuo Michinaka	SMTA Pan Pacific Hawaii Feb. 10-12, 2004 PREPUBLICATION ABSTRACT
No-flow Underfill Technology for Flip Chip Bonding	Akira Ohuchi	SMTA Pan Pacific Hawaii Feb. 10-12, 2004 PREPUBLICATION ABSTRACT
Evaporated Indium Bumps for Flip Chip Assembly	Kimberley A. Olver U.S. Army Research Laboratory	FlipChips Dot Com Tutorial 38 Feb. 1, 2004 Full Paper
Too much gold can be a bad thing.	Dr. George Riley FlipChips Dot Com	FlipChips Dot Com Tutorial 37 Jan. 1, 2004 Full Paper
MEMS Special Packaging Needs	Dr. Ken Gilleo ET-Trends LLC	FlipChips Dot Com Tutorial 36 Dec. 1, 2003 Full Paper
Measuring film thickness by spectral reflectance, Part 2	Filmetrics, Inc.	FlipChips Dot Com Tutorial 35 Nov. 1, 2003 Full Paper
Filled No-Flow Underfilling - Process and Materials	Ning-Chen Lee, Wusheng Yin, Hong-Sik Hwang	IMAPS International 2003 November 16 - 20, Boston MA PREPUBLICATION ABSTRACT
Epoxy Flux For Lead-Free Soldering	Ning-Chen Lee, Wusheng Yin	IMAPS International 2003 November 16 - 20, Boston MA PREPUBLICATION ABSTRACT
Wafer-Scale Packaging of Opto-Electronic Devices	D. Spencer, A. P. Malshe, R. B. Foster, C. B. O’Neal	IMAPS International 2003 November 16 - 20, Boston MA PREPUBLICATION ABSTRACT
Very High Pin Count Flip Chip Assembly Using Conductive Polymer Adhesives	James E. Clayton	IMAPS International 2003 November 16 - 20, Boston MA PREPUBLICATION ABSTRACT
Quality and Reliability of 100 MU Pitch Flip Chip ICS on Flexible Substrates with Adhesive Interconnections	J. de Vries	IMAPS International 2003 November 16 - 20, Boston MA PREPUBLICATION ABSTRACT
Three-D Vertically Stacked Electronic Structures for Array Sensors	R. Fillion, R. Wojnarowski, C. Kapusta, R. Saia, K. Kwiatkowski, J. Lyke	IMAPS International 2003 November 16 - 20, Boston MA PREPUBLICATION ABSTRACT
Vacuum Packaging of MEMS Inertial Sensors	Thomas F. Marinas Joseph W. Soucy	IMAPS International 2003 November 16 - 20, Boston MA PREPUBLICATION ABSTRACT
Wafer Level Vacuum Cavity Packaging for MEMS, Optoelectronics, and Sensors	Dr. George A. Riley	IMAPS International 2003 November 16 - 20, Boston MA PREPUBLICATION ABSTRACT
Packaging Challenges of High-Power LEDs for Solid State Lighting	Shatil Haque, Dan Steigerwald, Serge Rudaz, Bob Steward, Jerome Bhat, Dave Collins, Frank Wall, Sudhir Subramanya, Chris Elpedes, Phil Elizondo, Paul S. Martin	IMAPS International 2003 November 16 - 20, Boston MA PREPUBLICATION ABSTRACT
The Liquid Crystal Polymer Packaging Solution	Brian P. Farrell, Paul B. Jaynes, Tom Tiano, Jeremy Bowman	IMAPS International 2003 November 16 - 20, Boston MA PREPUBLICATION ABSTRACT
Near Hermetic Air Cavity Plastic Packaging for Wireless, MEMS and Optical Applications	John W. Roman	IMAPS International 2003 November 16 - 20, Boston MA PREPUBLICATION ABSTRACT
Low Temperature 0-Level Hermetic Packaging for MEMS based on Solder and Polymer Bonding	P. De Moor, K. Baert, B. Du Bois, G. Jamieson, A. Jourdain, H. A. C. Tilmans, M. Van de Peer, C. Van Hoof	IMAPS MEMS Workshop November 20 - 22, Boston MA PREPUBLICATION ABSTRACT
Advanced Packaging Techniques for MEMS Devices	Dan Crowley, Peter Cronin	IMAPS MEMS Workshop November 20 - 22, Boston MA PREPUBLICATION ABSTRACT
Sputtered nickel UBM for lead-free solder bumping	K. O'Donnell, J. Kostetsky, R. Devito,V. Bellido-Gonzalez, S. Powell, D. Monaghan	FlipChips Dot Com Tutorial 34 Oct. 1, 2003 Full Paper
Epoxy Flux Bridges The Gap To Low Cost No-Clean Flip Chip Assembly	Wusheng Yin, Geoffrey Beckwith,Hong-Sik Hwang, Lee Kresge, Ning-Cheng Lee	SMTA International 2003 Chicago, IL September 21 - 23, 2003 PREPUBLICATION ABSTRACT
Filled No-Flow Underfilling - Process and Materials	Wusheng Yin, Hong-Sik Hwang, Ning-Cheng Lee	SMTA International 2003 Chicago, IL September 21 - 23, 2003 PREPUBLICATION ABSTRACT
Optimization and Reliability of No-Flow Underfill Process	Michael Colella	SMTA International 2003 Chicago, IL September 21 - 23, 2003 PREPUBLICATION ABSTRACT
Assembly of Flip Chip on Flex for Low Cost Electronics Assembly	Jennifer Muncy	SMTA International 2003 Chicago, IL September 21 - 23, 2003 PREPUBLICATION ABSTRACT
New Electromigration Failure Mode in Flip Chip Solder Joints	C. Robert Kao	SMTA International 2003 Chicago, IL September 21 - 23, 2003 PREPUBLICATION ABSTRACT
Improving the Acceptance of Flip-Chip	J. G. Davis, C. Fieselman, A. Mays, K. Slesinger, H. Dalal	SMTA International 2003 Chicago, IL September 21 - 23, 2003 PREPUBLICATION ABSTRACT
Organic Flip Chip Packaging Challenges	C. G. Woychik, L. Liu, S. Wang, S. Rajagopalan, K. V. Desai	SMTA International 2003 Chicago, IL September 21 - 23, 2003 PREPUBLICATION ABSTRACT
Electroless wafer-level redistribution - further development and new approaches for system integration	L. Boettcher, A. Ostmann, R. Vieroth, H. Reichl	SMTA International 2003 Chicago, IL September 21 - 23, 2003 PREPUBLICATION ABSTRACT
Flip Chip on Standard Lead Frame: Lowering the Cost of Flip Chip Ownership	Frank Juskey	SMTA International 2003 Chicago, IL September 21 - 23, 2003 PREPUBLICATION ABSTRACT
High Reliability Underfill Performance through Proper Flip-Chip Die Attach Defluxing	S. Dalton J. Sander	IMAPS Flip Chip '03 Austin, TX June 16 - 18, 2003 PREPUBLICATION ABSTRACT
Advanced Flip-Chip Underfill Materials For Lead-Free Packaging and Assembly	M. Todd G. Carson	IMAPS Flip Chip '03 Austin, TX June 16 - 18, 2003 PREPUBLICATION ABSTRACT
Flip Chip Electromigration: Impact of Test Conditions in Product Life Predictions	H. Balkan	IMAPS Flip Chip '03 Austin, TX June 16 - 18, 2003 PREPUBLICATION ABSTRACT
An Objective Assessment of Printed and Plated Bumping Technologies	J. Ling, T. Tessier, W-S Shin, E. Law, I. Tan, D. Sahakian	IMAPS Flip Chip '03 Austin, TX June 16 - 18, 2003 PREPUBLICATION ABSTRACT
Bumping 300mm Copper/Low-K Semiconductors (UMB and Solder Deposition)	A. Strandjord C. Jauernig	IMAPS Flip Chip '03 Austin, TX June 16 - 18, 2003 PREPUBLICATION ABSTRACT
Technology enhancements in full-field lithography for Wafer Bumping	K. Ruhmer, D. Toennies, J. Kramer	IMAPS Flip Chip '03 Austin, TX June 16 - 18, 2003 PREPUBLICATION ABSTRACT
New Concepts of Material Deposition Technologies for 300mm Wafer Bumping	J. Kloeser T. Oppert	IMAPS Flip Chip '03 Austin, TX June 16 - 18, 2003 PREPUBLICATION ABSTRACT
Flip Chip Solder Bumping Compatibility on Cu / Low-k Devices	J. Ling, M. Rasco, P. Elenius, R. Auger, T. Strothmann	IMAPS Flip Chip '03 Austin, TX June 16 - 18, 2003 PREPUBLICATION ABSTRACT
Flip Chip Assembly With Wafer Applied Underfill	R. Wayne Johnson, Qing Wang, Fei Ding, Zhenwei Hou, Larry Crane, Gary Shi, Hao Tang, Marc Chason, Jan Danvir, Nadia Yala, Jing Qi, Prasanna Kulkanari	IMAPS Flip Chip '03 Austin, TX June 16 - 18, 2003 PREPUBLICATION ABSTRACT
Gold Stud Bump and Flip-Chip Attach	Jerry Jordan, Michael Fabel, Sheri Martin	IMAPS Flip Chip '03 Austin, TX June 16 - 18, 2003 PREPUBLICATION ABSTRACT
A Sputtered Nickel under Bump Metallurgy Structure for Lead-Free Solder for use in Flip Chip Packaging	K. O'Donnell, J. Kostetsky, R. Devito, V. Bellido-Gonzalez, S. Powell, D. Monaghan	IMAPS Flip Chip '03 Austin, TX June 16 - 18, 2003 PREPUBLICATION ABSTRACT
Stacked Die Using Flip Chip	Glenn Rinne	IMAPS Flip Chip '03 Austin, TX June 16 - 18, 2003 PREPUBLICATION ABSTRACT
A survey of wafer level hermetic cavity chip scale packages for RF applications	George Riley	FlipChips Dot Com June, 2003 Tutorial Full Text
Measuring thin films by spectral reflectance, Part 1	Filmetrics, Inc.	FlipChips Dot Com May, 2003 Tutorial Full Text
Plastic Hermetic Packages for MEMS, MOEMS & Optoelectronic Devices?	Dr. Ken Gilleo	APEX Anaheim, CA Mar 31- April 2, 2003 EXTENDED ABSTRACT
Advanced Component Technology Cleaning Effectiveness Study	Heather Benedict Mike Bixenman	APEX Anaheim, CA Mar 31- April 2, 2003 PREPUBLICATION ABSTRACT
A Novel Epoxy Flux For Lead-Free Soldering	Dr. Wusheng Yin Dr. Ning-Cheng Lee	APEX Anaheim, CA Mar 31- April 2, 2003 PREPUBLICATION ABSTRACT
A Novel Filled No-Flow Underfilling Process and Material	Dr. Wusheng Yin Dr. Hong-Sik Hwang Dr. Ning-Cheng Lee	APEX Anaheim, CA Mar 31- April 2, 2003 PREPUBLICATION ABSTRACT
Initiation of Interfacial Delaminations Relevant to Flip-Chip Assemblies	Brian J. McAdams Raymond A. Pearson	SMTA Pan Pacific Hawaii Feb. 18-20, 2003 PREPUBLICATION ABSTRACT
Ag-Sn Alloys as Conductive Fillers in ICAs	Kenichi Suzuki	SMTA Pan Pacific Hawaii Feb. 18-20, 2003 PREPUBLICATION ABSTRACT
An investigation on the reliability of CSP solder joints with numerous underfill materials	Sunny Zhang, Christina Chen, Dr. Shelgon Yee, Dr. AiChyun Shiah	SMTA Pan Pacific Hawaii Feb. 18-20, 2003 PREPUBLICATION ABSTRACT
Bumpless Flip Chip Packaging	Dr.Charles W. Lin, Sam Cheng-Lien Chiang	SMTA Pan Pacific Hawaii Feb. 18-20, 2003 PREPUBLICATION ABSTRACT
Development of Metal Joint Flip Chip Mounting Process using Surface Activated by Plasma Energy	Kazushi Higashi	SMTA Pan Pacific Hawaii Feb. 18-20, 2003 PREPUBLICATION ABSTRACT
Underfill Adhesive Films for Flip Chip and CSP Packages	Dr. David R. Gagnon Robert Zenner Dr. Ken Zieminski Dr. Mike Kropp	SMTA Pan Pacific Hawaii Feb. 18-20, 2003 PREPUBLICATION ABSTRACT
Epoxy Flux - An Answer For Low Cost No-Clean Flip Chip Assembly	Dr. Wusheng Yin Dr. Hong-Sik Hwang Lee Kresge Dr. Ning-Cheng Lee	NEPCON West San Jose December 3-6, 2002 PREPUBLICATION ABSTRACT
Low Cost No-Flow Underfilling Being A Reality For Manufacturing	Dr. Wusheng Yin Dr. Hong-Sik Hwang Dr. Ning-Cheng Lee	NEPCON West San Jose December 3-6, 2002 PREPUBLICATION ABSTRACT
Thermal aging characterization of OSP metal finishing for flip chip packaging with four layer laminate substrate	Mike C Loo Lily Zhao	NEPCON West San Jose December 3-6, 2002 PREPUBLICATION ABSTRACT
Ball Stacked Package Development for High Density DRAM Module Applications	Dr.Young-Gon Kim	NEPCON West San Jose December 3-6, 2002 PREPUBLICATION ABSTRACT
Eco-Controlling for Advanced Interconnection Technologies: Economics and Ecology of Flip Chip Technology	K. Schischke, O. Dinse, H. Griese, H. Reichl, J. Wiese, J. Wolf	CARE INNOVATION Vienna (Austria) November 25-28, 2002 PREPUBLICATION ABSTRACT
MEMS packaging: Wafer level Packaging for SME	E. Jung, M. Wiemer, V. Grosser, K. Bock, J. Wolf	ASME-IMEC New Orleans, Louisiana November 17-22, 2002 PREPUBLICATION ABSTRACT
Flip Chip on Paper Assembly Utilizing Anisotropic Conductive Adhesive	Jad Rasul and Bill Olson	SMTA International Sept 22-26, 2002 PREPUBLICATION ABSTRACT
Underfill Adhesive Choices for Chip and Package Applications	David R. Gagnon,  Steve C. Hackett,   Beth A. Fritcher,  Michael M. Ko	SMTA International Sept 22-26, 2002 PREPUBLICATION ABSTRACT
The Effects of Copper Content on the Reliability of SnAg-based Bump Alloys in Flip Chip Applications	Yeh Shing	SMTA International Sept 22-26, 2002 PREPUBLICATION ABSTRACT
System in Package Process Solutions Based On Flip Chip Processing	Daniel F. Baldwin, PhD Brian Lewis Paul Houston	SMTA International Sept 22-26, 2002 PREPUBLICATION ABSTRACT
Wafer-level redistribution using fully-additive Cu/Ni/Au Metallization	L. Boettcher Ch. Dombrowski A. Ostmann H. Reichl	SMTA International Sept 22-26, 2002 PREPUBLICATION ABSTRACT
A Novel Flip Chip Approach For Microwave/High Speed Data Chip Packaging	Tong Chen	SMTA International Sept 22-26, 2002 PREPUBLICATION ABSTRACT
Assembly Process for High Brightness LEDs Using the AuSn Metallurgy	G. Elger, R. Jordan, M. v. Suchodoletz, H. Oppermann	IMAPS 2002 Sept 4-6, 2002 PREPUBLICATION ABSTRACT
Modular Systems for Sensor Integration	M. Klein, H. Oppermann, R. Aschenbrenner, H. Reichl	IMAPS 2002 Sept 4-6, 2002 PREPUBLICATION ABSTRACT
Placement and reflow of solder balls for FC, BGA, Wafer-Level-CSP, Optoelectronic Components and MEMS by using a new solder jetting method	T. Oppert, L. Titerle, G. Azdasht, E. Zakel	IMAPS 2002 Sept 4-6, 2002 PREPUBLICATION ABSTRACT
Long Time Reliability of Flip Chip Interconnections On Flexible Substrates	B. Pahl, Ch. Kallmeyer, R. Aschenbrenner, H. Reichl	IMAPS 2002 Sept 4-6, 2002 PREPUBLICATION ABSTRACT
Materials for 300 mm Wafer Level Packaging	M. Toepper, A. Achen, Ch. Lopper, K. Hauck, K. Samulewics, V. Glaw, H. Reichl	IMAPS 2002 Sept 4-6, 2002 PREPUBLICATION ABSTRACT
Optimizing Adhesive Curing through UV / IR	Kevin Davis	SPIE Photonics 2002 July 30 - 31, 2002 PREPUBLICATION ABSTRACT
Low Cost, Wide Temperature Range Adhesive Flip-Chip Technology Using a Combination of ICA and NCA	Jan Vanfleteren, Björn Vandecasteele, Tomáš Podprocký	Flipchips 2002 June 24, 2002 PREPUBLICATION ABSTRACT
Flip Chip Molding: High Reliablity Flip Chip Encapsulation	T. Braun, K.- F. Becker, M. Koch, V. Bader, R. Aschenbrenner, H. Reichl	ECTC May 28, 2002 ABSTRACT
Calculation of Shape and Experimental Creation of AuSn Solder Bumps for Flip Chip Applications	M. Hutter, H. Oppermann, G. Engelmann, J. Wolf, O. Ehrmann, R. Aschenbrenner, H. Reichl	ECTC May 28, 2002 ABSTRACT
Gold-Tin Solder Electroplating of Photo-Resist Laminated AlN Ceramics	Siamak Akhlaghi, James N. Broughton, Douglas G. Ivey	ECTC May 28, 2002 ABSTRACT
Understanding Reliability Criteria for Solder Bumped Devices	Deborah S. Patterson	K&S White Paper May, 2002 Full Text
Fluxing for Flip Chip	Dr. Ning-Cheng Lee	Book Excerpt April, 2002 Full Text
Advanced Vapor Phase Cleaning Fluid for Demanding Flip Chip Cleaning Requirements	Mike Bixenman, David Ihms, Wayne Sozansky	IMAPS / SMTA Joint Symposium April 25, 2002 PREPUBLICATION ABSTRACT
Gold Stud Bump Bonding for High Frequency Packaging:Impact of Gang Coining and other Process Variables on Electrical Properties.	Taekyeong Lee, Alan M. Lyons, Sean Shih, Andy Becker and Carsten Metz	Garden State Spring Packaging Conference May 15, 2002 PREPUBLICATION ABSTRACT
No-Bump Flip-Die Power Products	George Riley	FlipChips Dot Com May, 2002 Full Text
Rescanning A Virtual Acoustic Flip Chip	Tom Adams	FlipChips Dot Com April, 2002 Full Text
Flip Chip Design Considerations	ReShape, Inc.	FlipChips Dot Com March, 2002 Full Text
Stud Bumping 300 mm Wafers	George Riley	FlipChips Dot Com February, 2002 Full Text
Efficient and Customizable Padring/Solderbump Generation	Peter Dahl	DesignCon 2002, January 29, 2002 ABSTRACT
Solder Sphere-Jet Bumping	George Riley	FlipChips Dot Com November, 2001 Full Text
A New Electrical Surface Joining Technology For Flip Chip Application	Bin Zou Robert J. Bahn Herbert J. Neuhaus	IMAPS 2001 October, 2001 Extended Abstract
Development of a Low Volume Flexible Flip Chip Process	Alan P. Boone	IMAPS 2001, October 9 - 11, 2001 ABSTRACT
Pre-applied Flip Chip Attachment	Scott Charles, Michael Kropp, Robert Kinney, Steve Hackett, Robert Zenner, and Bruce Li	IMAPS 2001, October 9 - 11, 2001 ABSTRACT
Flip Chip Joining of Thin Chips on Flexible PEN Substrates	Erja Jokinen, Professor Eero Ristolainen	IMAPS 2001, October 9 - 11, 2001 ABSTRACT
Lead-Free Solder Bump Technologies For Flip-Chip Packaging Applications	Zaheed S.Karim, Rob Schetty	IMAPS 2001, October 9 - 11, 2001 ABSTRACT
Indium Bump Bonding for Cryogenic Applications	Allen C. Keeney	IMAPS 2001, October 9 - 11, 2001 ABSTRACT
Technology and material for the CSP flux-free underfill resin and process for electrical connection and physical adhesion at the reflow process simultaneously	Kenji Kitamura, Naoki Kanagawa, Tomoaki Nemoto, Shoichi Fujimori, Shinji Hashimoto	IMAPS 2001, October 9 - 11, 2001 ABSTRACT
Low cost solder bumping via paste reflow for area array packages	Ning-Cheng Lee, Benlih Huang	IMAPS 2001, October 9 - 11, 2001 ABSTRACT
Novel Alignment Technologies for Wafer Level Packaging	Friedrich Paul Lindner, Christian Schaefer, Bob Michaels, Thomas Glinsner	IMAPS 2001, October 9 - 11, 2001 ABSTRACT
Inexpensive processes for Flip Chip manufacturing	Karel Malysz, Ivan Szendiuch	IMAPS 2001, October 9 - 11, 2001 ABSTRACT
Lead-Free Solder Alloys for Flip Chip Applications Using Stencil Printing	Scott Popelar, Andrew Strandjord, Larry Heitz	IMAPS 2001, October 9 - 11, 2001 ABSTRACT
Assembly and Reliability of a Wafer Scale CSP	Anthony Primavera, Parvez Patel, K. Srihari	IMAPS 2001, October 9 - 11, 2001 ABSTRACT
Z-axis Interconnection for 3-D High-Density Packaging	Silke Spiesshoefer, Leonard Schaper, Kaoru Maner, Errol Porter, Fred Barlow, Michael Glover, George Bates, Mike Lucas, Bill Marsh	IMAPS 2001, October 9 - 11, 2001 ABSTRACT
Flip Chip Market Trends	E. Jan Vardaman, Linda Matthew	IMAPS 2001, October 9 - 11, 2001 ABSTRACT
Electrical and Thermal Performance of a New Process for High Density LED Array Assembly	Michael E. Wernle, Michael Kober	IMAPS 2001, October 9 - 11, 2001 ABSTRACT
Wafer-level Redistribution Using Electroless Cu Deposition	L. Boettcher, Ch. Dombrowski, A. Ostmann, H. Reichl	SMTAI 2001, Sept 30 - Oct 4, 2001 ABSTRACT
Investigation of Anisotropic Conductive Adhesive Interconnect Assembly Process onto an Organic Substrate	David Geiger, Pamela Chang, Alington Lewis, Charles Ward, Sammy Yi, Minna Arra	SMTAI 2001, Sept 30 - Oct 4, 2001 ABSTRACT
Low Cost Solder Bumping Via Paste Reflow	Dr. Benlih Huang, Dr. Xiaohua Bao, and Dr. Ning-Cheng Lee	SMTAI 2001, Sept 30 - Oct 4, 2001 ABSTRACT
Low Cost Flip Chip on Paper Assembly Utilizing Non-Thermal Cure Materials	Ali Tootoonchi and Jad Rasul	SMTAI 2001, Sept 30 - Oct 4, 2001 ABSTRACT
Flip Chip Underfilling with Non-conductive Photo-Initiated Adhesives: A new Approach	Robert Saller	SMTAI 2001, Sept 30 - Oct 4, 2001 ABSTRACT
The Impact of Copper Content on the Reliability of Sn-Ag-Cu Bump Alloy in Flip Chip Applications	Shing Yeh	SMTAI 2001, Sept 30 - Oct 4, 2001 ABSTRACT
Wafer Level Burn-In (WLBI) for Flip Chip Applications	Erik Jung, C. Landesberger, D. Wojakowski, R. Aschenbrenner, H. Reichl	Interpack 2001, July 8 - 13, 2001 ABSTRACT
Solder Bumping Step by Step	Deborah S. Patterson K&S Flip Chip Division	Advanced Packaging Magazine July 2001 Full Text
Lead-Free Flip Chip on Halogen-Free High Density Microvia Substrates	G. Baynham, D. Baldwin, K. Boustedt, A. Johansson, C. Wennerholm, F. Mattsson, S. Kandelid P. Elenius, D. Patterson, H. Balkan	IMAPS Flip Chip 2001, June 18 - 20, 2001 ABSTRACT
Removal of Flux Residues under Flip Chip Dense Array Packages using HFC Vapor Phase Technology	Mike Bixenman	IMAPS Flip Chip 2001, June 18 - 20, 2001 ABSTRACT
Flip Chip Reliability	D. Blass and P. Borgeson	IMAPS Flip Chip 2001, June 18 - 20, 2001 ABSTRACT
Flip Chip Assembly and Yield Considerations for Various Fluxing Methods	D. Blass and A. Prats	IMAPS Flip Chip 2001, June 18 - 20, 2001 ABSTRACT
The Size Effect of Solder Joints Under Thermal Load with and without Lead	J. H. Chou Y. C. Pai C. H. Ding	IMAPS Flip Chip 2001, June 18 - 20, 2001 ABSTRACT
Solder Extrusions and Underfill Delaminations: A Remarkable Flip Chip Qualification Experience	A. Genovese F. Fontana M. Cesana	IMAPS Flip Chip 2001, June 18 - 20, 2001 ABSTRACT
A No-Flow Underfill with Excellent Reliability Performance	S. Hackett, M. Kropp, S. Charles, R. Kinney, R. Zenner	IMAPS Flip Chip 2001, June 18 - 20, 2001 ABSTRACT
Assembly with Fluxing Underfills: Modeling and Experimentation	R. W. Johnson, R. Zhao, Y. Zang, D. Harris, P. Krug, E. Yaeger, L. Crane	IMAPS Flip Chip 2001, June 18 - 20, 2001 ABSTRACT
Process and Reliability Study of Newest Generation No-Flow Fluxing Underfill	Douglas Katze, D. Blass, A. Prats	IMAPS Flip Chip 2001, June 18 - 20, 2001 ABSTRACT
New Materials Deposition Technique for Bumping	J. Kloeser, J. Myers, R. Heynen, U. Schäfer, P. Coskina	IMAPS Flip Chip 2001, June 18 - 20, 2001 ABSTRACT
Evaluation of Lead-Based and Lead-Free Solder Alloys in Conjuction with an Electroless Nickel Flip Chip	S. Popelar A. Strandjord C. Erickson	IMAPS Flip Chip 2001, June 18 - 20, 2001 ABSTRACT
Minimalist Type Packaging Utilizing Unbumped Die and Bumped Substrates	C. M. Schreiber Z. P. Wang	IMAPS Flip Chip 2001, June 18 - 20, 2001 ABSTRACT
300 mm Wafers, A Challenge for Wafer Bumping Technologies	Michael Töpper, V. Glaw, L. Dietrich, H. Reichl	IMAPS Flip Chip 2001, June 18 - 20, 2001 ABSTRACT
Flip Chip on Flex for Low Cost Electronics Assembly	J. Venton, D. Baldwin, M. Richmond, P. Harvey	IMAPS Flip Chip 2001, June 18 - 20, 2001 ABSTRACT
Current Crowding in Flip Chip Solder Bump and its Effects on Electromigration	E.C.C. Yeh, W. Choi, K.N. Tu, P. Elenius, H. Balkan	IMAPS Flip Chip 2001, June 18 - 20, 2001 ABSTRACT
Stud Bump Flip Chip Assembly of MEMS Motion Sensors	George Riley	IMAPS New England 28th Symposium May 8, 2001 FULL TEXT
Options in High Density Part Cleaning	Ken Gilleo (Ed.)	Technology Update May 1, 2001 FULL TEXT
Reworking Underfilled Flip Chips	Don Moore, Gloria Studley	FlipChips Tutorial May 1, 2001 FULL TEXT
Gold to Gold Thermosonic Flip-Chip Bonding	L. K. Cheah, Y. M. Tan, J. Wei, C. K. Wong	HD International 2001, April 18 - 20, 2001 ABSTRACT OR FULL TEXT (680K PDF)
A Study on Advanced Flip Chip Interconnect Technologies for Space Application	Sharon Ling, Binh Le, Ark Lew, Elbert Nhan	HD International 2001, April 18 - 20, 2001 ABSTRACT
Room Temperature Flip Chip Assembly of CdZnTe Pixel Detector Arrays	George Riley and Steven Bornstein	HD International 2001, April 18 - 20, 2001 ABSTRACT
Electroless Nickel-Gold Flip Chip	George Riley	FlipChips Tutorial April 1, 2001 TEXT
Ultra Thin Chips for Miniaturized Products	Erik Jung, A. Ostmann, C. Landesberger, D. Wojakowski, R. Aschenbrenner,H. Reichl	Micro Systems 2001, March 27 - 29, 2001 ABSTRACT
Eco-Analysis of Wafer Level Bumping	Karsten Schischke, Hansjörg Griese, Dr. Jutta Müller	Micro Systems 2001, March 27 - 29, 2001 ABSTRACT
A Brief History of Flipped Chips	Ken Gilleo	FlipChips Tutorial March 1, 2001 TEXT
Product Development and Implementation of a Self-Fluxing Underfill (FluxFill) Into Wireless Communication Products	Bryan Anderson, Bruce Chan, Jim Lance	SMTA Pan Pacific Symposium, February 13-15, 2001 ABSTRACT
Flip-Chip on Organic Carrier Assembly Evaluation	Donald Banks, Scott Bahe, Duy Le-Huu	SMTA Pan Pacific Symposium, February 13-15, 2001 ABSTRACT
Adhesion of Flip-Chip Underfills to Various Die Passivations Before and After Accelerated Environmental Exposure	Mark Dimke	SMTA Pan Pacific Symposium, February 13-15, 2001 ABSTRACT
Development of Flip Chip Mounting Process by Metallic Joint Using Ultrasonic Wave Energy	Kazushi Higashi and Kazuya Ushirakawa	SMTA Pan Pacific Symposium, February 13-15, 2001 ABSTRACT
Flip Chip on Board Yield Enhancement Due to Solder Flux and Solder Paste Process Control	Stacy Kalisz	SMTA Pan Pacific Symposium, February 13-15, 2001 ABSTRACT
Significant Reliability Enhancement using New Anisotropic Conductive Adhesives for Flip Chip on Organic Substrates Applications	Kyung W. Paik and Myung-Jin Yim	SMTA Pan Pacific Symposium, February 13-15, 2001 ABSTRACT
Fluxless Solder Flip Chip bonding using Non-Conductive Paste	A. Yamauchi and T. Mori	SMTA Pan Pacific Symposium, February 13-15, 2001 ABSTRACT
Anisotropic Conductive Film for Flipchip Applications: An Introduction	Peter Opdahl	FlipChips Tutorial February, 2001 TEXT
Improving Flip-Chip Manufacturing Through Proper Cleaning	Michael Todd and Mike Bixenman	Advanced Packaging, January 2001 FULL TEXT
Cleaning Stencil Printed Wafer Bumping	Kyzen Corporation	Application Note
Cleaning Electroplated Wafer Bumping	Kyzen Corporation	Application Note
Cleaning Evaporative Vapor Phase Wafer Bumping	Kyzen Corporation	Application Note
Polymer Bump Flip Chip	Richard Estes	FlipChips Tutorial January, 2001 TEXT
Flip Chip Interconnection using Redistribution Technology	M. Töpper, P.Coskina, K.-F. Becker, O. Ehrmann, H. Reichl	FlipChips Update December, 2000 TEXT
Stud Bump Flip Chip	George A. Riley	FlipChips Tutorial December, 2000 TEXT
Critical Issues of Wafer Level Chip Scale Package with Emphasis on Cost Analysis	John H. Lau	FlipChips Update November, 2000 TEXT
Solder Bump Flip Chip	George A. Riley	FlipChips Tutorial November, 2000 TEXT
Underfill Update: NUF, MUF, WUF and Other Stuff	Ken Gilleo	FlipChips Update October, 2000 TEXT
Introduction to Flip Chip	George A. Riley	FlipChips Tutorial October, 2000 TEXT
Flip Chip CSP Technology Overview	Robert Erich	IMAPS CSP Workshop September, 2000 TEXT
Picking Your Flipchip: A Comparison of Flipchip Methods and Benefits	George A. Riley	Electronics Manufacturing Engineering Vol. 15, #3, 3rd Quarter 2000 TEXT
Comparing Flip-Chip and Wire-Bond Interconnection Technologies	Peter Elenius & Lee Levine	Chip Scale Review July-August 2000 TEXT
POLYMER SOLDERS: THE COOL LEAD-FREE ALTERNATIVE?	Ken Gilleo	SMTA Lead Free Symposium, June 12, 2000 ABSTRACT
LEAD FREE SOLDERS FOR AREA ARRAY PACKAGING	Joachim Kloeser	SMTA Lead Free Symposium, June 12, 2000 ABSTRACT
Automating Underfill for Non-Traditional Packages, Secondary CSP Underfill, Stacked Die, and No-Flow Underfill	Alec J. Babiarz	SMTA Pan Pacific Symposium, January 2000 ABSTRACT
Low Cost High Volume Production of a Fine Pitch DCA Assembly	Scott Joslin	SMTA 2000 Pan Pacific Symposium, January 2000 ABSTRACT
Application Specific Flip Chip Packages: Considerations and Options in Using FCIP	P. Mescher, C. Scanlan, R. Erich, C. Parker, P. O'Brien	SMTA 2000 Pan Pacific Symposium, January 2000 TEXT
Evaluation of Underfill in Flip Chip and BGA on PC Boards using 3D Reconstruction and Through-Transmission Imaging	Janet Semmens	SMTA Pan Pacific Symposium, January 2000 ABSTRACT
Flip Chip on Organic Substrates	Peter Borgesen	SMTA Surface Mount International, September, 1999 ABSTRACT
High-Speed Second-Level CSP and Flip Chip Assembly using Flip Chip Shooters	Günter Schiebel	SMTA Surface Mount International, September, 1999 ABSTRACT
Reliability Analysis of Flip Chip on Board Assemblies Using No-Flow Underfill Materials	Ryan Thorpe	SMTA Surface Mount International, September, 1999 ABSTRACT
Transforming Flip Chip into CSP with Reworkable Wafer-Level Underfill	Ken Gilleo	SMTA Pan Pacific Symposium, February, 1999 ABSTRACT
Influence of Coefficient of Thermal Expansion of Adhesive Resin in a Resin Pressure Contact Flip Chip	Mitsuru Mura	SMTA Pan Pacific Symposium, February 1999 ABSTRACT
Acoustic Microscopy of Flip Chip Packages	Joel Sigmund	SMTA Pan Pacific Symposium, February 1999 ABSTRACT
Development of Reliable Assembly Methodology and Materials for a Robust Flip Chip on Organic Laminates	Abhay Maheshwari	SMTA Emerging Technologies, November 1998 ABSTRACT
A Low Cost Wafer Bumping Process for Flip Chip Applications	Scott F. Popelar	SMTA Emerging Technologies, November 1998 ABSTRACT
In-Process Stress Analysis of Flip Chip Assemblies During Underfill Cure	Prema Palaniappan	SMTA Surface Mount International, August, 1998 ABSTRACT
Flip Chip Underfill Characterization Methods: Developing a Test Methodology for Success in the Harsh Automotive Environment	James M. Rosson	SMTA Surface Mount International, August, 1998 ABSTRACT
Cleaning for High Reliability Flip Chip on Laminate Assembly	Robin L. Sellers	SMTA Surface Mount International, August, 1998 ABSTRACT
High Thermal Conductivity Greases for use in CSP, Flip Chip and Near CSP Packages	Ron Hunadi	SMTA Chip Scale Packaging, May 1998 ABSTRACT
Effects of Underfill Materials and Assembly Processes on Moisture Sensitivity of Flip Chip Assemblies	Craig Beddingfield	SMTA Surface Mount International, April, 1997 ABSTRACT
Surface Laminar Circuit Printed Wiring Board and Direct Chip Attach Flip Chip	Miguel Jimarez	SMTA Surface Mount International, April 1997 ABSTRACT
Reflow-Curable Polymer Fluxes for Flip Chip Assembly	R. Wayne Johnson	SMTA Surface Mount International, April 1997 ABSTRACT
Flip Chip Bonding on Printed Circuit Board using Anisotropically Conductive Adhesive Film	Kyoung H. Kim	SMTA Surface Mount International, April 1997 ABSTRACT
A New Production Line for Low Cost Flip Chip Assembly	Joachim Kloeser	SMTA Surface Mount International, April 1997 ABSTRACT
Design Issues for Flip Chip Modules	Rob Lyn	SMTA Surface Mount International, April, 1997 ABSTRACT
Bump, Dip, Flip: Single Chip	George A. Riley	SMTA Surface Mount International, April 1997 ABSTRACT
Paradigm Shift in Interconnection Technologies	Paul A. Totta	SMTA Surface Mount International, April 1997 ABSTRACT
Flip Chip for Flex Applications	S. Arndt	SMTA Surface Mount International, September 1996. ABSTRACT
Implementation of Flip Chip Technology for BGA Packages	R. Aschenbrenner	SMTA Surface Mount International, September 1996. ABSTRACT
Low Cost Flip Chip Assembly	Caroline Beelen	SMTA Surface Mount International, September 1996. ABSTRACT
Thermal Properties of Flip Chip Encapsulant	Wei Koh	SMTA Surface Mount International, September 1996. ABSTRACT
Integration of Flip Chip assembly with Surface Mount Technology	A. James McLenaghan	SMTA Surface Mount International, September, 1996. ABSTRACT
Low Cost Techniques for Flip Chip Soldering	Andreas Ostmann	SMTA Surface Mount International, September, 1996. ABSTRACT