An independent site providing free technical information that I select based on my 12 years helping more than 50 companies solve their micropackaging problems as a microelectronics manufacturer and as a consultant.

Sources include:

Everything from classic 10 year old papers to expert tutorials to new books to pre-conference abstracts of papers not yet delivered.

Subjects include:

• flip chip bumping, assembly, underfill

• MEMS hermetic and near-hermetic packaging

• optoelectonics and nano-optics packaging

• sensors and detector arrays

• wafer-level hermetic packaging

• hermetic cavity chip-scale packaging

• more than 50 tutorials, from basics to advanced concepts

• searchable literature bibliography with links

• technology updates with archived full-text articles

• photos and SEM photos of assemblies and devices

• books on packaging, with reviews and links

• pre-conference abstracts of upcoming technical papers

• suppliers of services, equipment, and materials.

• a free monthly newsletter describes the latest information postings.

For more help:

Visit my "Doctor FlipChip" consulting site for information about paid personal consulting, technical writing, and editing services.