FlipChips Dot Com free micropackaging information

FlipChips Dot

Com Flip Chip Information

FlipChips Dot Com - FREE micropackaging technical information.

Flip Chip -- MEMS -- Nanolithography -- Optronics -- Wafer Level Packaging

Over 450 searchable pages of free information, 200,000 page views last year.

"Doctor FlipChip" Consulting and Technical Writing / Editing

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An independent site providing free technical information that I select based on my 16 years helping more than 80 companies solve their micropackaging problems as a microelectronics manufacturer and as a consultant.

Sources include:

Everything from classic 10 year old papers to expert tutorials to new books to pre-conference abstracts of papers not yet delivered.

Subjects include:

flip chip bumping, assembly, underfill
MEMS hermetic and near-hermetic packaging
optoelectonics and nano-optics packaging
sensors and detector arrays
Nanotechnology applications in micropackaging
hermetic cavity chip-scale packaging

Formats include:

more than 80 tutorials, from basics to advanced concepts
searchable literature bibliography with links
technology updates with archived full-text articles
photos and SEM photos of assemblies and devices
books on packaging, with reviews and links
pre-conference abstracts of upcoming technical papers
suppliers of services, equipment, and materials.
a free monthly newsletter describes the latest information postings.

For more help:

Visit my "Doctor FlipChip" consulting site for information about paid personal consulting, technical writing, and editing services.

Site Sponsors
Arc Technologies Flip chip services. Flip chip tooling.
E&G Partners Technology and business development
Finetech FC Bonders and rework stations.
SET SAS Highest accuracy device bonders.
TLMI Corp Wafer bumping and services.
Doctor Flipchip Consulting and training, technical writing & editing.

FlipChips Dot Com
210 Park Ave #300
Worcester, MA 01609 USA

Phone 508-753-3572
FAX 508-757-0220
EMAIL DrRiley @ flipchips.com

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