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The Books page contains titles, book reviews, and links to Table of Contents, sample pages, and purchasing information for books on flip chip, chip-scale packaging, and related technologies.
Books
FREE Industrial Forensics Problem Solving Book
A free 2 meg PDF version of "The Day Niagara Falls Turned Green" (Industrial Forensics) by Dr. Ken Gilleo, can be downloaded at http://et-trends.com/case_studies/case_studies.html. The 167-page book contains 101 case histories from around the world. All are true! Most mysteries have been solved, but a few are left for the reader. The detectives and forensic investigators include scientists, engineers, technicians and factory workers. Some mysteries are easier to solve, but others are complex and take considerable effort to unravel. A final chapter, "HOW TO BE A SUPER SLEUTH", is included as a guide to industrial problem solving. And if you have a solved mystery, it can be uploaded for future publication in the next edition of a book on Industrial Forensics.
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Lead-Free Solder Interconnect Reliability
Donkai Shangguan, Editor
ASM International 2005. 302 pages. ISBN 0-88170-816-7
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Adhesives Technology for Electronics Applications
James J. Licari & Dale W. Swanson
William Andrew, Inc. 2005. 450 pages. ISBN 0-8155-1513-8
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MEMS / MOEMS PACKAGING
Ken Gilleo
McGraw-Hill, 2005. 235 pages. ISBN 0-07-145556-6
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Implementing Lead-Free Electronics
by Dr. Jennie S. Hwang
McGraw - Hill, 2005. 507 pages. ISBN 0 07 144374 6
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ENVIRONMENT-FRIENDLY ELECTRONICS:
LEAD-FREE TECHNOLOGY
by Dr. Jennie S. Hwang
Electrochemical Publications Ltd, 2001. 910 pages. ISBN 0 901150 40 1
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FUNDAMENTALS OF MICROSYSTEMS PACKAGING
by Rao Tummala
McGraw-Hill, 2001. 967 pages. ISBN 0-07-137169-9
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AREA ARRAY PACKAGING HANDBOOK
Ken Gilleo, Editor
McGraw-Hill, 2001. 800 pages. ISBN 0-07-137493-0
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MICROVIAS For Low Cost, High Density Interconnects
by John H. Lau & S. W. Ricky Lee
McGraw-Hill, 2001. 550 pages. ISBN 0-07-136327-0
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REFLOW SOLDERING PROCESSES AND
TROUBLESHOOTING:
SMT, BGA, CSP, and Flip Chip Technologies
by Ning-Cheng Lee
Newnes, 2002. 280 pages. ISBN 0-7506-7218-8
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Flip Chip Technologies
by John H. Lau, Editor
McGraw-Hill 1995. 565 pages. ISBN 0-07-036609-8
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