The Semiconductor Equipment Division of Fancort Industries has just introduced a new flip-chip pick and place option to mount on their full line of Dr. Tresky die bonders. The new system consists of a motorized color ccd camera with split prism, locking table, and 15" LCD color monitor which allows for a clear view of the die bumps and substrate. The entire system is compact, and mounts to the bonder frame to keep the operator’s work area open and accessible for placement. It can also be used to pick bumped die from a wafer using the unique Tresky patented fixed die ejector needle with vacuum pull down. This method puts no stress on the die including very fragile gallium arsenide.

The flip-chip system is simple to use. The operator picks the flip chip with the fixed position vacuum pick up tool and moves the arm to the correct focus height, which has been preset. Then the worktable is moved in the X-Y direction to the approximate placement position, or it can first be moved to a fluxing station. The operator then automatically moves the optical unit into the active position so the image of the substrate and component can be seen simultaneously on the screen. Final alignment of both images in the X-Y position is accomplished with the unique Tresky micromanipulator that uses translation screws with high-resolution encoders, and theta is changed with the arm rotation knob. Once alignment is made, the table can be locked, the optical unit moved automatically out of the way, and the component is placed manually or automatically with the proper bonding parameters, such as force, time and temperature. The entire process can take less than two minutes.

The new system can be installed on all new manual T3000 or semiautomatic T3100 Tresky die bonders. Both machines have a variety of other options that are available including eutectic bonding, adhesive dispense, adhesive stamping, heated pick up tools and much more.

For additional information contact Jim Regester, Email jregester@fancort.com