PREPUBLICATION ABSTRACT

SMTA Pan Pacific
February 10 - 12, 2009
CONFERENCE INFORMATION

 

SYSTEM-ON-WAFER BY 3D ALL SILICON SYSTEMS TECHNOLOGY

Rao Tummala, Ritwik Chatterjee, P. Markondeya Raj and Venky Sundaram

Georgia Institute of Technology

Rolf Aschenbrenner and Herbert Reichl

Fraunhofer Institute

Joungho Kim

Korea Advanced Institute of Science and Technology (KAIST)

 

Electronics has been, and continues to be, one of the largest global industries. It has been the driving engine for science, engineering and manufacturing, leading to the global prosperity not only in the U.S. but also in those parts of the world that invested and participated in it.

 

The first electronics wave, which started with the invention of the transistor, has been largely due to Moore’s Law or the First Law of Electronics, and the associated hybrid approaches from design to systems using 100s of discrete components made of ceramics, organics, silicon, metals and alloys. The end of the era using this approach seems evident beyond 32nm.

 

The second need is to do with greatly improved volumetric functional density, which requires miniaturization of the entire system, which is currently at milliscale, and which can be developed to nanoscale. Such a concept, over the long term, leads to an all silicon system-on-wafer concept presented in this paper.