µPILR™ Package Platform- A Higher Density Package-on-Package Innovation for Next Generation Electronics

The motivation for developing higher density IC packaging continues to be the portable handset and personal entertainment market. The consumers’ expectation is that each new generation of products exhibit expanded functionality while maintaining a relatively small form factor.

To meet this challenge, a number of unique high density IC package innovations have evolved. Many of these miniature IC package innovations have proved ideal for a growing number of consumer electronic applications. A growing number of 3D Package-on-Package configurations have already been integrated into the high-volume electronic market and some are even furnishing improved performance capability for larger high-end commercial servers and computing systems.

The challenge electronic manufactures face when competing in the world marketplace is to offer a product that will meet all physical demands and performance expectations without increasing the end products size or cost.

The material developed for this paper will review potential market segments for 3D packaging and outline current expectations for multiple-function IC packaging for a number of electronic applications. The information presented will also focus on performance modeling and the stringent qualification test performed specifically for the vertically configured µPILR package technology.

A key advantage of this package-on-package configuration is that each layer of the package is significantly thinner than other ball-stack package methodologies. It has a considerable advantage over die-stack packaging as well because each section can be pre-tested before joining. This pre-test capability greatly improves the overall manufacturing yield and functionality of the final package assembly is assured.