Practical 3D System-in-Package Solution for Mixed IC Technology Applications

Hand-held communication and entertainment products continue to dominate the consumer markets worldwide and, with each generation offering more and more features and/or capability, system level integration and miniaturization becomes more of a priority. And even though the actual functionality of the new product offering expands, the customer is expecting each generation to be smaller and lighter that its predecessor. The challenge manufactures face when competing in the world marketplace is to offer a product that will meet all performance and functionality expectations within budget and without increasing product size. Increased electronic functionality can be achieved through the development of more complex silicon integration but that route generally requires a great deal of capital resources and an excessive amount of time.

Many of the multiple-die package concepts are proving superior to the system-on-chip alternative because it minimizes risk and has the potential for economically integrating several different but complementary functions. Although these 'stacked-die' package innovations are already in wide use, many companies furnishing packaging services for these die are not meeting manufacturing yields and the difficulty of simultaneous testing of multiple mixed technology die is not always practical. Without implementing more innovative package methods, the functional capability of the product may never reach expectation or achieve manufacturing cost objectives.

The paper developed for the IMAPS program will present a view of current expectations for multiple function packaging for wireless applications and detail the development of a new 'stacked micro-pin package' methodology that offers a practical high-yield solution for packaging a broad range of system-in-package applications. A key advantage of the package technology is that each layer in the stacked package can be pre-tested before joining. This capability greatly improves the manufacturing yield and functional reliability of the final package is assured.

The information presented by the author will illustrate all structural elements of the package technology, outline the assembly methodology, review environmental qualification test results and preview the first micro-pin stacked packages developed for commercial applications.