Imbedded Die assembly process, is it ready yet?

Jim D. Raby, P.E.

jraby@stielectronicsinc.com

Imbedded Die, (a patented process) bare die, active circuits buried in FR-4 and   other organic substrates, with heat dissipation and greatly reduced board size.  IC/DT.

One ask why Imbedded, the term embedded generally refers to software.  This is hardware.

Purpose;

To reduce board size, reduce parasitics’ resulting from standard component packaging, and dissipate heat more efficiently.  To eliminate the need for solder joints that have be-come a major concern as a result of tin-whiskers and the use of lead.

Results;

This paper will show the steps that have been taken in design, test and manufacture of this technology.  The results of military flight test and actual flight performance.

The circuit boards required specific tooling, and graphic design problems to provide 3 – d

cavities in the boards, with embedded heat sinking materials.

This technology reduces the amount of board space by more than 50%, which provides for greater  payload in weight or fuel.

This technology has been tested to withstand 20Kg of shock, and rigorous flight test on board a US Navy missile.

This technology is ready for us in any hardware that needs to be rugged and needs better heat sinking.  It is also covered with a copper laminated lid that can be sealed to expose tampering, reduce handling problems.  It is near hermetic sealed.  This is a rework able technology.

High level military states that this is the technology that all military hardware should be made with.  It is a patented technology, held by STI, patent # 7,116,557, dated Oct 06.