System in Package Combining Flip Chip Bonding and 3-D Stacking using a Highly Flexible Device Bonder

The development of mobile equipment is pushing the need for miniaturization in the packaging industry. The density of the SIP (system-in-package) is increased by extended into the third dimension. The combination of flip chip technology together with 3-D stacking of chips or packages (POP, package-on-package) enables the development of high density multi function devices. The POP approach contributes to higher yield thanks to better testability. The use of a highly flexible device bonder to assemble a new high density 3-D stack package of SIP (system-in-package) devices is presented.