Liquid Crystal Polymer Printed Circuit Board based Opto-electronic and Electronic Packaging with Functionally Hermetic Performance

We present liquid crystal polymer (LCP) based opto and electronic packaging with functionally hermetic performance with respect to moisture ingress. We have previously presented a LCP based packaging approach on printed circuit board platforms that allows design flexibility and integration together with the excellent electrical properties of LCP's.

In this paper we present results for LCP PCB based test vehicle designs where internal moisture content is shown to remain well below the MIL-STD-883-1018 allowed 5000ppm level after exposure to 1000 hours of 85^oC / 85% relative humidity. Using these design approaches, LCP packaging could be used for applications requiring hermeticity, thus taking advantage of the cost, design and performance benefits of LCP printed circuit board based packaging approaches.

This packaging approach has been applied to optoelectronic, electronic and micro-fluidic applications which we summarize in this paper.