PREPUBLICATION ABSTRACT

IMAPS 2006
October 8 - 12, 2006
CONFERENCE INFORMATION

 

Nanocomposites and Nanoparticle Fluids for Microelectronic Packaging Applications

Emmanuel P. Giannelis -- Cornell University

 

In the first part of this talk, I will review our research effort in nanocomposites and emphasize work related to understanding their mechanical performance including our latest work with hierarchical nanocomposites via directed assembly of nanoparticles.

In the second part, I will present our recent work in "solvent-free" nanoparticle fluids. These new material systems based on inorganic nanoparticle cores and a surface corona, combine fluidity and transport properties similar to molecular liquids with zero vapor pressure.

By properly selecting the type, shape, or size of the core nanoparticles and the corona chemistry, one could efficiently optimize any set of properties including viscosity, transparency, refractive index, conductivity and surface tension.