New IC Packaging Structures for System in Package Applications

IC packaging has in recent years become the gating technology relative to meeting the performance needs of next generation electronics systems both in terms of cost and performance. While significant improvements continue to be made in IC packaging technology, further improvements are possible which can extract more performance at reduced power.

This paper describes a new family of stair stepped IC packaging and interconnection structures that can be used both with traditional substrates and with newer stair stepped substrates to significantly improve the performance of system in package constructions.