Advanced Packaging Techniques for MEMS Devices

This presentation will explain how standard automation technologies previously available for semiconductor and advanced packaging are applied in the assembly of MEMS devices.

Existing and evolving applications for these miniature systems include sensors for automotive (airbag deployment, pressure sensors & accelerometers), Medical Systems (Bio Chips, chip based assays for drug discovery and disease diagnostics), sensors (chemical temperature), Telecommunications (switches), micro-motors, and video projections. These applications require specialized approaches to packaging.

The concepts of eutectic attach, flip chip bonding and epoxy bonding are explained, with the focus on how these assembly techniques can be used to handle delicate MEMS devices with internal features and moving elements. Eutectic die bonding is explained in detail, with a discussion including process description and a description of three means of automated eutectic bonding. Details are provided on achieving eutectic bonds, such as controlled force, inert environment, dedicated collets, scrub parameters, and accuracy.

All of this is presented using MEMS switches and pressure sensors as examples, in order to explain how these packaging techniques apply to the specific requirements of MEMS. The presentation includes photos and videos of actual equipment and components being eutectically bonded.